Inventor
CHEN SHIH-LI
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SHIH-LI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED CHIP ENG TECH INC
4 patentsUS7667318B2Feb 23, 2010
Fan out type wafer level package structure and method of the same
ADVANCED CHIP ENG TECH INC56 citations97
US7557437B2Jul 7, 2009
Fan out type wafer level package structure and method of the same
ADVANCED CHIP ENG TECH INC25 citations92
US7224061B2May 29, 2007
Package structure
ADVANCED CHIP ENG TECH INC8 citations72
US7985626B2Jul 26, 2011
Manufacturing tool for wafer level package and method of placing dies
ADVANCED CHIP ENG TECH INC0 citations52
CAESAR TECHNOLOGY INC
4 patentsUS6087586AJul 11, 2000
Chip scale package
CAESAR TECHNOLOGY INC26 citations91
US5851337ADec 22, 1998
Method of connecting TEHS on PBGA and modified connecting structure
CAESAR TECHNOLOGY INC49 citations91
US6236567B1May 22, 2001
Electronic device package with enhanced heat dissipation effect
CAESAR TECHNOLOGY INC4 citations61
US6068129AMay 30, 2000
Indicating adhesion status between substrate and encapsulant of a packaged electronic device
CAESAR TECHNOLOGY INC1 citations51
YANG WEN-KUN
3 patentsUS7196408B2Mar 27, 2007
Fan out type wafer level package structure and method of the same
YANG WEN-KUN84 citations97
US7459781B2Dec 2, 2008
Fan out type wafer level package structure and method of the same
YANG WEN-KUN52 citations96
US7262081B2Aug 28, 2007
Fan out type wafer level package structure and method of the same
YANG WEN-KUN55 citations96