Inventor
YING MING
SG24 patents
⚠️ This page may combine multiple inventors who share the name “YING MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
6 patentsUS7598606B2Oct 6, 2009
Integrated circuit package system with die and package combination
STATS CHIPPAC LTD87 citations98
US7388280B2Jun 17, 2008
Package stacking lead frame system
STATS CHIPPAC LTD15 citations84
US7064430B2Jun 20, 2006
Stacked die packaging and fabrication method
STATS CHIPPAC LTD16 citations83
US7986032B2Jul 26, 2011
Semiconductor package system with substrate having different bondable heights at lead finger tips
STATS CHIPPAC LTD7 citations82
US7598599B2Oct 6, 2009
Semiconductor package system with substrate having different bondable heights at lead finger tips
STATS CHIPPAC LTD10 citations82
US7968377B2Jun 28, 2011
Integrated circuit protruding pad package system
STATS CHIPPAC LTD1 citations51
CORNING INC
5 patentsUS11346984B2May 31, 2022
Liquid lenses
CORNING INC2 citations72
US12466766B2Nov 11, 2025
Laser bonding of glass to thin metal foil
CORNING INC1 citations60
US11852560B2Dec 26, 2023
Devices with liquid lenses and test methods and assemblies for testing devices with liquid lenses
CORNING INC0 citations58
US12124103B2Oct 22, 2024
Liquid lens
CORNING INC0 citations51
US11992894B2May 28, 2024
Method of separating a liquid lens from an array of liquid lenses
CORNING INC0 citations45
UNIV ILLINOIS
3 patentsUS9554484B2Jan 24, 2017
Appendage mountable electronic devices conformable to surfaces
UNIV ILLINOIS131 citations97
US10357201B2Jul 23, 2019
Appendage mountable electronic devices conformable to surfaces
UNIV ILLINOIS14 citations93
US10052066B2Aug 21, 2018
Appendage mountable electronic devices conformable to surfaces
UNIV ILLINOIS14 citations91