Integrated circuit package system with die and package combination

Abstract

An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

1. An integrated package system with die and package combination comprising:
 forming a leadframe having internal leads and external leads; 
 encapsulating a first integrated circuit on the leadframe; 
 attaching a conductive layer over the encapsulation of the first integrated circuit; and 
 encapsulating a second integrated circuit over the encapsulated first integrated circuit. 
 
     
     
       2. The system as claimed in  claim 1  wherein forming the leadframe further comprises forming the internal leads having a different pitch than that of the external leads. 
     
     
       3. The system as claimed in  claim 1  wherein forming the leadframe further comprises forming a die pad and tie bars. 
     
     
       4. The system as claimed in  claim 1  wherein encapsulating the second integrated circuit further comprises encapsulating a package having the first integrated circuit. 
     
     
       5. An integrated package system with die and package combination comprising:
 a leadframe having internal leads and external leads; 
 a first integrated circuit encapsulated by a first encapsulant on the leadframe; 
 a conductive layer over the encapsulation of the first integrated circuit; and 
 a second integrated circuit encapsulated with the first encapsulant by a second encapsulant. 
 
     
     
       6. The system as claimed in  claim 5  wherein the leadframe further comprises the internal leads having a different pitch than that of the external leads. 
     
     
       7. The system as claimed in  claim 5  wherein the leadframe further comprises a die pad and tie bars. 
     
     
       8. The system as claimed in  claim 5  wherein the second encapsulant further comprises a package having the first integrated circuit. 
     
     
       9. The system as claimed in  claim 5  further comprising:
 first electrical interconnects between the first integrated circuit and the internal leads of the leadframe; and 
 second electrical interconnects between the second integrated circuit and the external leads of the leadframe. 
 
     
     
       10. The system as claimed in  claim 9  wherein the leadframe further comprises the internal leads connected to the external leads. 
     
     
       11. The system as claimed in  claim 9  wherein the leadframe further comprises a power-ground ring interconnecting the external leads. 
     
     
       12. The system as claimed in  claim 9  wherein the leadframe further comprises a matrix of the integrated circuit package system with die and package combination. 
     
     
       13. The system as claimed in  claim 9  wherein the second integrated circuit further comprises the second integrated circuit on a mold cap formed by a first encapsulant without internal dam bars.