Inventor

SHIM IL KWON

SG212 patents

⚠️ This page may combine multiple inventors who share the name “SHIM IL KWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIM IL KWON

STATS CHIPPAC LTD

Method of forming stress relief layer between die and interconnect structure

Method of mounting an integrated circuit package in an encapsulant cavity

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming the device using sacrificial carrier

Semiconductor device and method of forming an interposer package with through silicon vias

Integrated circuit package system with die and package combination

Method of fabricating a 3-D package stacking system

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Pre-molded leadframe and method therefor

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Multichip module package and fabrication method

Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

AMKOR TECHNOLOGY INC

Multi-stacked memory package

Semiconductor package with spacer strips

Semiconductor package and method for fabricating the same

Package for stacked integrated circuits

Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Semiconductor package and method for fabricating the same

ST ASSEMBLY TEST SERVICES LTD

Stacked semiconductor packages and method for the fabrication thereof

Stacked semiconductor packages

Semiconductor package with passive device integration

Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

ANAM SEMICONDUCTOR INC

Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same

Ball grid array semiconductor package using a metal carrier ring as a heat spreader

Flexible circuit board for ball grid array semiconductor package

Method of manufacturing ball grid array semiconductor package

SHIM IL KWON

Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

ANAM IND CO LTD

Ball grid array semiconductor package with ring-type heat sink

Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages

CHOW SENG GUAN

Integrated circuit package system with interposer

Bridge stack integrated circuit package-on-package system

ST ASSEMBLY TEST SERVICE LTD

PBGA substrate for anchoring heat sink

KOO JUN MO

Semiconductor device and method of bonding different size semiconductor die at the wafer level

MARIMUTHU PANDI CHELVAM

Semiconductor device and method of forming an interposer package with through silicon vias

AMKOR ELECTRONICS INC

Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same

CHOI HAENGCHEOL

Electronic system with expansion feature

ANAM IND COL LTD

Ball grid array semiconductor package with improved heat dissipation and dehumidification effect

LIN YAOJIAN

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

PENDSE RAJENDRA D

Integrated circuit package system for package stacking and method of manufacture therefor