Inventor

LIN TING-HAO

TW52 patents

⚠️ This page may combine multiple inventors who share the name “LIN TING-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN TING-HAO

KINSUS INTERCONNECT TECH CORP

Carrier board structure

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole

Method of fabricating board having high density core layer and structure thereof

Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure

Double sided board with buried element and method for manufacturing the same

Winged coil structure and method of manufacturing the same

Electromagnetic-interference shielding device

Electromagnetic-interference shielding device

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Ameliorated compound carrier board structure of flip-chip chip-scale package

Manufacturing method of the embedded passive device

Method for fabricating IC board without ring structure

Buildup board structure

Manufacturing method of double layer circuit board

Manufacturing method of a semiconductor load board

Method for fabricating buried capacitor structure

Embedded passive device structure and manufacturing method thereof

Manufacturing method of double layer circuit board

Landless multilayer circuit board and manufacturing method thereof

Double layer circuit board

Multi-layer circuit board

Method of manufacturing winged coil structure

Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure

Buildup board structure

Manufacturing method of landless multilayer circuit board

Multi-layer circuit board

Electromagnetic-interference shielding device and method for manufacturing the same

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Stacked multilayer structure

Chip support board structure

Manufacturing method of non-etched circuit board

Method of manufacturing a multilayer substrate structure for fine line

Antenna carrier plate structure

Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon

Magnetic excitation coil structure

Method of manufacturing a stacked multilayer structure

Package structure of a chip and a substrate

CHANG CHIEN-WEI

Method for fabricating component-embedded printed circuit board

Method of fabricating board having high density core layer and structure thereof

Method for manufacturing a heat dissipation structure of a printed circuit board

High-density fine line structure and method of manufacturing the same

Method for fabricating an interlayer conducting structure of an embedded circuitry

COMPEQ MANUFACTURING COMPANY L

Packaging method for a ball grid array integrated circuit without utilizing a base plate

Transfer flat type ball grid array method for manufacturing packaging substrate

Ball grid array packaging method for an integrated circuit and structure realized by the method

Solid tape automated bonding packaging method

KAYLU IND CORP

Light emitting diode bulb having high heat dissipating efficiency

Method of fabricating light emitting diode device with multiple encapsulants

GOLD CIRCUIT ELECTRONICS LTD

Composite circuit board and method for manufacturing the same