Inventor · disambiguated record
Toyosei Takahashi
Also filed as: TAKAHASHI TOYOSEI
6 granted patents·15 pending applications·10 citations·filing 2000–2010
70Inventor score
Files withSUMITOMO BAKELITE CO12SATO TOSHIHIRO3DEJIMA HIROHISA2TAKAHASHI TOYOSEI2SHIRAISHI FUMIHIRO1
Top patents by PatentIndex Score
21 records- 0155US6768197B2Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2000·Granted Jul 27, 2004·9 cites·36 claims
- 0252US2011221017A1Photosensitive resin composition, photosensitive adhesive film, and light-receiving deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 0351US2011101484A1Light-receiving device and method of manufacturing the sameSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 0450US7999354B2Resin composition, filling material, insulating layer and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Aug 16, 2011·1 cites·17 claims
- 0550US2010297439A1Photosensitive adhesive resin composition, adhesive film and light-receiving deviceSUMITOMO BAKELITE CO·Filed 2008·Application pending·0 cites
- 0647US8034651B2Light receiving device and method of manufacturing light receiving deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Oct 11, 2011·0 cites·10 claims
- 0744US7768089B2Semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Aug 3, 2010·0 cites·23 claims
- 0844US2011316116A1Photosensitive resin composition, adhesive film and light-receiving deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0942US2011008611A1Photosensitive resin composition, film for photosensitive resin spacer, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 1042US2012032284A1Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing sameDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 1138US7947343B2Adhesive filmSUMITOMO BAKELITE CO·Filed 2006·Granted May 24, 2011·0 cites·11 claims
- 1238US2010193122A1Process for manufacturing electronic deviceSUMITOMO BAKELITE CO·Filed 2008·Application pending·0 cites
- 1338US2010183983A1Process for manufacturing electronic deviceSUMITOMO BAKELITE CO·Filed 2008·Application pending·0 cites
- 1437US2010164126A1Resin composition, resin spacer film, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Application pending·0 cites
- 1536US2011316127A1Spacer formation film, semiconductor wafer and semiconductor deviceSHIRAISHI FUMIHIRO·Filed 2010·Application pending·0 cites
- 1632US2012168970A1Spacer formation film, method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 1731US2012012989A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 1830US2012187553A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceYONEYAMA MASAHIRO·Filed 2010·Application pending·0 cites
- 1929US2011304034A1Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor deviceDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 2028US8268540B2Method of manufacturing light receiving deviceTAKAHASHI TOYOSEI·Filed 2007·Granted Sep 18, 2012·0 cites·16 claims
- 2125US2012196075A1Resin composition, semiconductor wafer bonding product and semiconductor deviceTAKAHASHI TOYOSEI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →