Inventor · disambiguated record
Masakazu Kawata
Also filed as: KAWATA MASAKAZU
5 granted patents·10 pending applications·124 citations·filing 1999–2011
71Inventor score
Top patents by PatentIndex Score
15 records- 0191US6039896AAnisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesiveSUMITOMO BAKELITE CO·Filed 1999·Granted Mar 21, 2000·124 cites·14 claims
- 0247US8034651B2Light receiving device and method of manufacturing light receiving deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Oct 11, 2011·0 cites·10 claims
- 0344US7768089B2Semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Aug 3, 2010·0 cites·23 claims
- 0444US2011316116A1Photosensitive resin composition, adhesive film and light-receiving deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0542US2012032284A1Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing sameDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 0635US2013009172A1Method of manufacture of light-emitting element and light-emitting element manufactured therebySUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 0732US2012228782A1Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device packageKAWATA MASAKAZU·Filed 2010·Application pending·0 cites
- 0832US2012168970A1Spacer formation film, method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0931US2012012989A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 1030US2012187553A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceYONEYAMA MASAHIRO·Filed 2010·Application pending·0 cites
- 1130US2011263095A1Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 1229US2011304034A1Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor deviceDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 1328US8268540B2Method of manufacturing light receiving deviceTAKAHASHI TOYOSEI·Filed 2007·Granted Sep 18, 2012·0 cites·16 claims
- 1427US9399725B2Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameTAKEUCHI ETSU·Filed 2010·Granted Jul 26, 2016·0 cites·23 claims
- 1525US2012196075A1Resin composition, semiconductor wafer bonding product and semiconductor deviceTAKAHASHI TOYOSEI·Filed 2010·Application pending·0 cites
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