Inventor

MAHAJAN RAVINDRANATH V

US51 patents

⚠️ This page may combine multiple inventors who share the name “MAHAJAN RAVINDRANATH V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAHAJAN RAVINDRANATH V

INTEL CORP

Integrated circuit package with embedded bridge

Localized high density substrate routing

Electro-osmotic pumps and micro-channels

Interconnect architecture with silicon interposer and EMIB

Localized high density substrate routing

Integrated circuit package with embedded bridge

Integrated circuit package with embedded bridge

System and method for providing tactile feedback

Embedded bridge with through-silicon Vias

Embedded bridge with through-silicon vias

Method of making an electromagnetic interference shield for semiconductor chip packages

Patch on interposer architecture for low cost optical co-packaging

Distributed semiconductor die and package architecture

Stacked die cavity package

Adaptive exoskeleton, control system and methods using the same

Methods for high precision microelectronic die integration

Multi-die ultrafine pitch patch architecture and method of making

Thermal interface thickness control for a microprocessor

Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios

Distributed semiconductor die and package architecture

Heat management system

Multi-chip packages and sinterable paste for use with thermal interface materials

Nested interposer with through-silicon via bridge die

Enabling long interconnect bridges

Wireless charging system

Embedded photonic integrated circuits

Multiple die package using an embedded bridge connecting dies

Interconnect architecture with silicon interposer and EMIB

Interconnect architecture with silicon interposer and EMIB

Stacked die cavity package

Bridge hub tiling architecture

Projecting contacts and method for making the same

Embedded bridge die with through-silicon vias

Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making

Embedded bridge with through-silicon vias

BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load

Full package vapor chamber with IHS

Multiple die package using an embedded bridge connecting dies

Dual-sided co-packaged optics for high bandwidth networking applications

Dual-sided co-packaged optics for high bandwidth networking applications

Magnetic intermetallic compound interconnect

Methods for high precision microelectronic die integration

Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

High bandwidth optical interconnection architectures

Method to enable interposer to interposer connection

SWAMINATHAN RAJASEKARAN

Magnetically sintered conductive via

Magnetic intermetallic compound interconnect

GOMES WILFRED

Distributed semiconductor die and package architecture

MAHAJAN RAVINDRANATH V

Electromagnetic interference shield for semiconductor chip packages

ALEKSOV ALEKSANDAR

Flexible computing fabric