Inventor
LIN CHUN-CHENG
TW85 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS10636715B2Apr 28, 2020
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9799631B2Oct 24, 2017
Semiconductor packaging structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10879192B1Dec 29, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations81
US11848300B2Dec 19, 2023
Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12057359B2Aug 6, 2024
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11456226B2Sep 27, 2022
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424213B2Aug 23, 2022
Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9978716B2May 22, 2018
Package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9892962B2Feb 13, 2018
Wafer level chip scale package interconnects and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627369B2Apr 18, 2017
Packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9287233B2Mar 15, 2016
Adhesive pattern for advance package reliability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11158605B2Oct 26, 2021
Semiconductor packaging structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10832999B2Nov 10, 2020
Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12278208B2Apr 15, 2025
Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322421B2May 3, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9269687B2Feb 23, 2016
Packaging methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG7 citations84
US9230935B2Jan 5, 2016
Package on package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG5 citations84
US8901726B2Dec 2, 2014
Package on package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG14 citations84
US9082636B2Jul 14, 2015
Packaging methods and structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG4 citations73
US9142523B2Sep 22, 2015
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG2 citations63
ACADEMIA SINICA
4 patentsUS7323176B2Jan 29, 2008
Immuno-modulating antitumor activities of ganoderma lucidum (reishi) polysaccharides
ACADEMIA SINICA13 citations91
US7135183B1Nov 14, 2006
Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharides
ACADEMIA SINICA30 citations91
US8354234B2Jan 15, 2013
Mass spectrometric analysis of ligand conjugated magnetic nanoparticles
ACADEMIA SINICA8 citations79
US7695738B2Apr 13, 2010
Carbohydrate encapsulated nanoparticles
ACADEMIA SINICA4 citations62
LIN CHUN-CHENG
4 patentsUS9412689B2Aug 9, 2016
Semiconductor packaging structure and method
LIN CHUN-CHENG6 citations84
US7500759B2Mar 10, 2009
Retractable lighting device for barbecue stove
LIN CHUN-CHENG12 citations84
US8520793B2Aug 27, 2013
Phase detector, phase detecting method, and clock-and-data recovery device
LIN CHUN-CHENG6 citations72
US8365716B2Feb 5, 2013
Barbecue grill assembly
LIN CHUN-CHENG3 citations63
CHEN MENG-TSE
4 patentsUS9312214B2Apr 12, 2016
Semiconductor packages having polymer-containing substrates and methods of forming same
CHEN MENG-TSE7 citations84
US9412717B2Aug 9, 2016
Apparatus and methods for molded underfills in flip chip packaging
CHEN MENG-TSE6 citations73
US9030022B2May 12, 2015
Packages and methods for forming the same
CHEN MENG-TSE3 citations63
US8609462B2Dec 17, 2013
Methods for forming 3DIC package
CHEN MENG-TSE4 citations63
DELL PRODUCTS LP
3 patentsUS10172252B1Jan 1, 2019
Information handling system having an ergonomic plunger for a server planar board
DELL PRODUCTS LP2 citations72
US10721835B2Jul 21, 2020
Information handling system with an adjustable guide for peripheral cards
DELL PRODUCTS LP3 citations69
US11163343B1Nov 2, 2021
Flexible power supply unit (PSU) bay
DELL PRODUCTS LP5 citations68
SCRIPPS RESEARCH INST
2 patentsLIN CHUN CHENG
2 patentsLIN CHIH-WEI
1 patentTAIWAN FU HSING IND CO LTD
1 patentLIN CHENG-CHUNG
1 patentYEH SHU-HUA
1 patentYU CHEN-HUA
1 patentCHENG MING-DA
1 patentHEWLETT PACKARD DEVELOPMENT CO LP
1 patentTSENG CHEN
1 patentM31 TECH CORP
1 patentHUANG KUEI WEI
1 patentWANG YUAN-YUAN
1 patentShowing the top 50 of 85 patents by PatentIndex Score.