P

Inventor

LIN CHUN-CHENG

TW85 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

15 patents
US10636715B2Apr 28, 2020

Semiconductor package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9799631B2Oct 24, 2017

Semiconductor packaging structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10879192B1Dec 29, 2020

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations81
US11848300B2Dec 19, 2023

Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12057359B2Aug 6, 2024

Semiconductor package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11456226B2Sep 27, 2022

Semiconductor package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424213B2Aug 23, 2022

Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9978716B2May 22, 2018

Package structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9892962B2Feb 13, 2018

Wafer level chip scale package interconnects and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627369B2Apr 18, 2017

Packages and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9287233B2Mar 15, 2016

Adhesive pattern for advance package reliability improvement

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11158605B2Oct 26, 2021

Semiconductor packaging structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10832999B2Nov 10, 2020

Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12278208B2Apr 15, 2025

Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322421B2May 3, 2022

Package structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

TAIWAN SEMICONDUCTOR MFG

5 patents

ACADEMIA SINICA

4 patents

LIN CHUN-CHENG

4 patents

CHEN MENG-TSE

4 patents

DELL PRODUCTS LP

3 patents

SCRIPPS RESEARCH INST

2 patents

LIN CHUN CHENG

2 patents

LIN CHIH-WEI

1 patent

TAIWAN FU HSING IND CO LTD

1 patent

LIN CHENG-CHUNG

1 patent

YEH SHU-HUA

1 patent

YU CHEN-HUA

1 patent

CHENG MING-DA

1 patent

HEWLETT PACKARD DEVELOPMENT CO LP

1 patent

TSENG CHEN

1 patent

M31 TECH CORP

1 patent

HUANG KUEI WEI

1 patent

WANG YUAN-YUAN

1 patent

Showing the top 50 of 85 patents by PatentIndex Score.