Inventor

MYUNG BOK SIK

KR4 patents

Patents

4 patents

US10431536B2Oct 1, 2019

Interposer substrate and semiconductor package

SAMSUNG ELECTRONICS CO LTD53 citations92

US9627126B2Apr 18, 2017

Printed circuit board including inductor

SAMSUNG ELECTRONICS CO LTD2 citations65

US11289430B2Mar 29, 2022

Semiconductor package and a method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations57

US8970042B2Mar 3, 2015

Circuit board, comprising a core insulation film

SAMSUNG ELECTRONICS CO LTD1 citations49