Inventor
CAO JIANJUN
US64 patents
⚠️ This page may combine multiple inventors who share the name “CAO JIANJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INT RECTIFIER CORP
18 patentsUS7075147B2Jul 11, 2006
Low on resistance power MOSFET with variably spaced trenches and offset contacts
INT RECTIFIER CORP40 citations93
US7161208B2Jan 9, 2007
Trench mosfet with field relief feature
INT RECTIFIER CORP30 citations92
US6563197B1May 13, 2003
MOSgated device termination with guard rings under field plate
INT RECTIFIER CORP19 citations92
US7973304B2Jul 5, 2011
III-nitride semiconductor device
INT RECTIFIER CORP8 citations84
US7619280B2Nov 17, 2009
Current sense trench type MOSFET with improved accuracy and ESD withstand capability
INT RECTIFIER CORP12 citations84
US6639276B2Oct 28, 2003
Power MOSFET with ultra-deep base and reduced on resistance
INT RECTIFIER CORP15 citations84
US7579650B2Aug 25, 2009
Termination design for deep source electrode MOSFET
INT RECTIFIER CORP16 citations83
US7482654B2Jan 27, 2009
MOSgated power semiconductor device with source field electrode
INT RECTIFIER CORP13 citations83
US7368353B2May 6, 2008
Trench power MOSFET with reduced gate resistance
INT RECTIFIER CORP7 citations72
US8952352B2Feb 10, 2015
III-nitride power device
INT RECTIFIER CORP2 citations63
US8536624B2Sep 17, 2013
Active area shaping for III-nitride devices
INT RECTIFIER CORP1 citations63
US7091080B2Aug 15, 2006
Depletion implant for power MOSFET
INT RECTIFIER CORP6 citations63
US6893923B2May 17, 2005
Reduced mask count process for manufacture of mosgated device
INT RECTIFIER CORP4 citations63
US6846706B2Jan 25, 2005
Power MOSFET with ultra-deep base and reduced on resistance
INT RECTIFIER CORP2 citations63
US7410851B2Aug 12, 2008
Low voltage superjunction MOSFET
INT RECTIFIER CORP4 citations62
US7390717B2Jun 24, 2008
Trench power MOSFET fabrication using inside/outside spacers
INT RECTIFIER CORP6 citations62
US6969657B2Nov 29, 2005
Superjunction device and method of manufacture therefor
INT RECTIFIER CORP4 citations62
US7679111B2Mar 16, 2010
Termination structure for a power semiconductor device
INT RECTIFIER CORP6 citations57
EFFICIENT POWER CONVERSION CORP
15 patentsUS10312131B2Jun 4, 2019
Semiconductor devices with back surface isolation
EFFICIENT POWER CONVERSION CORP7 citations83
US10096702B2Oct 9, 2018
Multi-step surface passivation structures and methods for fabricating same
EFFICIENT POWER CONVERSION CORP7 citations83
US9837438B2Dec 5, 2017
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP6 citations83
US8350294B2Jan 8, 2013
Compensated gate MISFET and method for fabricating the same
EFFICIENT POWER CONVERSION CORP16 citations83
US9214461B2Dec 15, 2015
GaN transistors with polysilicon layers for creating additional components
EFFICIENT POWER CONVERSION CORP9 citations82
US8890168B2Nov 18, 2014
Enhancement mode GaN HEMT device
EFFICIENT POWER CONVERSION CORP14 citations81
US10312260B2Jun 4, 2019
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP3 citations72
US10090274B2Oct 2, 2018
Flip chip interconnection with reduced current density
EFFICIENT POWER CONVERSION CORP2 citations72
US9171911B2Oct 27, 2015
Isolation structure in gallium nitride devices and integrated circuits
EFFICIENT POWER CONVERSION CORP6 citations72
US11050339B2Jun 29, 2021
Integrated circuit with multiple gallium nitride transistor sets
EFFICIENT POWER CONVERSION CORP0 citations62
US10601300B2Mar 24, 2020
Integrated gallium nitride based DC-DC converter
EFFICIENT POWER CONVERSION CORP1 citations62
US12463632B2Nov 4, 2025
Integrated circuit for gate overvoltage protection of power devices
EFFICIENT POWER CONVERSION CORP0 citations61
US10622455B2Apr 14, 2020
Enhancement-mode GaN transistor with selective and nonselective etch layers for improved uniformity in GaN spacer thickness
EFFICIENT POWER CONVERSION CORP1 citations60
US11121245B2Sep 14, 2021
Field plate structures with patterned surface passivation layers and methods for manufacturing thereof
EFFICIENT POWER CONVERSION CORP1 citations58
US10312335B2Jun 4, 2019
Gate with self-aligned ledge for enhancement mode GaN transistors
EFFICIENT POWER CONVERSION CORP0 citations52
LIDOW ALEXANDER
7 patentsUS8404508B2Mar 26, 2013
Enhancement mode GaN HEMT device and method for fabricating the same
LIDOW ALEXANDER27 citations92
US8823012B2Sep 2, 2014
Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same
LIDOW ALEXANDER31 citations91
US8436398B2May 7, 2013
Back diffusion suppression structures
LIDOW ALEXANDER21 citations91
US9607876B2Mar 28, 2017
Semiconductor devices with back surface isolation
LIDOW ALEXANDER13 citations82
US8853749B2Oct 7, 2014
Ion implanted and self aligned gate structure for GaN transistors
LIDOW ALEXANDER8 citations82
US8969918B2Mar 3, 2015
Enhancement mode gallium nitride transistor with improved gate characteristics
LIDOW ALEXANDER3 citations62
US8785974B2Jul 22, 2014
Bumped, self-isolated GaN transistor chip with electrically isolated back surface
LIDOW ALEXANDER2 citations62
UNIVERSAL ELECTRONICS INC
4 patentsUS6829512B2Dec 7, 2004
System and method for creating a controlling device
UNIVERSAL ELECTRONICS INC105 citations97
US6785579B2Aug 31, 2004
System and method for creating a controlling device
UNIVERSAL ELECTRONICS INC99 citations97
US6640144B1Oct 28, 2003
System and method for creating a controlling device
UNIVERSAL ELECTRONICS INC142 citations97
USRE39716EJul 3, 2007
System and method for creating a controlling device
UNIVERSAL ELECTRONICS INC22 citations91
BRIERE MICHAEL A
1 patentEFFICIENT POWER CONV CORP
1 patentCAO JIANJUN
1 patentBEACH ROBERT
1 patentGD MIDEA AIR CONDITIONING EQUIPMENT CO LTD
1 patentUNIV JIANGNAN
1 patentShowing the top 50 of 64 patents by PatentIndex Score.