Inventor
LIDOW ALEXANDER
US42 patents
⚠️ This page may combine multiple inventors who share the name “LIDOW ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INT RECTIFIER CORP
19 patentsUS4593302AJun 3, 1986
Process for manufacture of high power MOSFET with laterally distributed high carrier density beneath the gate oxide
INT RECTIFIER CORP173 citations99
US4376286AMar 8, 1983
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP154 citations99
US5742087AApr 21, 1998
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP90 citations96
US5598018AJan 28, 1997
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP77 citations96
US5338961AAug 16, 1994
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP67 citations96
US5191396AMar 2, 1993
High power mosfet with low on-resistance and high breakdown voltage
INT RECTIFIER CORP50 citations96
US5130767AJul 14, 1992
Plural polygon source pattern for mosfet
INT RECTIFIER CORP73 citations96
US5008725AApr 16, 1991
Plural polygon source pattern for MOSFET
INT RECTIFIER CORP102 citations96
US4959699ASep 25, 1990
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP92 citations96
US4705759ANov 10, 1987
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP98 citations96
US4680853AJul 21, 1987
Process for manufacture of high power MOSFET with laterally distributed high carrier density beneath the gate oxide
INT RECTIFIER CORP114 citations96
US4642666AFeb 10, 1987
High power MOSFET with low on-resistance and high breakdown voltage
INT RECTIFIER CORP76 citations96
US4412242AOct 25, 1983
Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
INT RECTIFIER CORP67 citations96
US4399449AAug 16, 1983
Composite metal and polysilicon field plate structure for high voltage semiconductor devices
INT RECTIFIER CORP95 citations96
US4789882ADec 6, 1988
High power MOSFET with direct connection from connection pads to underlying silicon
INT RECTIFIER CORP42 citations93
US8368120B2Feb 5, 2013
Hybrid semiconductor device having a GaN transistor and a silicon MOSFET
INT RECTIFIER CORP20 citations92
US8017978B2Sep 13, 2011
Hybrid semiconductor device
INT RECTIFIER CORP40 citations92
US4416708ANov 22, 1983
Method of manufacture of high speed, high power bipolar transistor
INT RECTIFIER CORP18 citations73
US7955969B2Jun 7, 2011
Ultra thin FET
INT RECTIFIER CORP3 citations63
EFFICIENT POWER CONVERSION CORP
14 patentsUS10312131B2Jun 4, 2019
Semiconductor devices with back surface isolation
EFFICIENT POWER CONVERSION CORP7 citations83
US9837438B2Dec 5, 2017
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP6 citations83
US8350294B2Jan 8, 2013
Compensated gate MISFET and method for fabricating the same
EFFICIENT POWER CONVERSION CORP16 citations83
US9214461B2Dec 15, 2015
GaN transistors with polysilicon layers for creating additional components
EFFICIENT POWER CONVERSION CORP9 citations82
US8890168B2Nov 18, 2014
Enhancement mode GaN HEMT device
EFFICIENT POWER CONVERSION CORP14 citations81
US10312260B2Jun 4, 2019
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP3 citations72
US9171911B2Oct 27, 2015
Isolation structure in gallium nitride devices and integrated circuits
EFFICIENT POWER CONVERSION CORP6 citations72
US11050339B2Jun 29, 2021
Integrated circuit with multiple gallium nitride transistor sets
EFFICIENT POWER CONVERSION CORP0 citations62
US10601300B2Mar 24, 2020
Integrated gallium nitride based DC-DC converter
EFFICIENT POWER CONVERSION CORP1 citations62
US10312335B2Jun 4, 2019
Gate with self-aligned ledge for enhancement mode GaN transistors
EFFICIENT POWER CONVERSION CORP0 citations52
US10600674B2Mar 24, 2020
Semiconductor devices with back surface isolation
EFFICIENT POWER CONVERSION CORP0 citations51
US9214399B2Dec 15, 2015
Integrated circuit with matching threshold voltages and method for making same
EFFICIENT POWER CONVERSION CORP1 citations51
US9331191B2May 3, 2016
GaN device with reduced output capacitance and process for making same
EFFICIENT POWER CONVERSION CORP1 citations50
US9214528B2Dec 15, 2015
Method to fabricate self-aligned isolation in gallium nitride devices and integrated circuits
EFFICIENT POWER CONVERSION CORP0 citations40
LIDOW ALEXANDER
7 patentsUS8404508B2Mar 26, 2013
Enhancement mode GaN HEMT device and method for fabricating the same
LIDOW ALEXANDER27 citations92
US8823012B2Sep 2, 2014
Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same
LIDOW ALEXANDER31 citations91
US8436398B2May 7, 2013
Back diffusion suppression structures
LIDOW ALEXANDER21 citations91
US9607876B2Mar 28, 2017
Semiconductor devices with back surface isolation
LIDOW ALEXANDER13 citations82
US8853749B2Oct 7, 2014
Ion implanted and self aligned gate structure for GaN transistors
LIDOW ALEXANDER8 citations82
US8969918B2Mar 3, 2015
Enhancement mode gallium nitride transistor with improved gate characteristics
LIDOW ALEXANDER3 citations62
US8785974B2Jul 22, 2014
Bumped, self-isolated GaN transistor chip with electrically isolated back surface
LIDOW ALEXANDER2 citations62