Inventor
BRADL STEPHAN
DE20 patents
⚠️ This page may combine multiple inventors who share the name “BRADL STEPHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
13 patentsUS7906860B2Mar 15, 2011
Semiconductor device
INFINEON TECHNOLOGIES AG53 citations96
US7687895B2Mar 30, 2010
Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips
INFINEON TECHNOLOGIES AG30 citations92
US6337255B1Jan 8, 2002
Method for forming a trench structure in a silicon substrate
INFINEON TECHNOLOGIES AG25 citations91
US10566309B2Feb 18, 2020
Multi-purpose non-linear semiconductor package assembly line
INFINEON TECHNOLOGIES AG3 citations72
US6459296B2Oct 1, 2002
Method, system and method of using a component for setting the electrical characteristics of microelectronic circuit configurations
INFINEON TECHNOLOGIES AG8 citations71
US11652084B2May 16, 2023
Flat lead package formation method
INFINEON TECHNOLOGIES AG0 citations62
US11302668B2Apr 12, 2022
Multi-purpose non-linear semiconductor package assembly line
INFINEON TECHNOLOGIES AG0 citations62
US6447372B1Sep 10, 2002
Polishing agent for semiconductor substrates
INFINEON TECHNOLOGIES AG4 citations61
US7911036B2Mar 22, 2011
Semiconductor wafer with rear side identification and method
INFINEON TECHNOLOGIES AG3 citations58
US7759792B2Jul 20, 2010
Integrated circuit including parylene material layer
INFINEON TECHNOLOGIES AG0 citations52
US7566378B2Jul 28, 2009
Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
INFINEON TECHNOLOGIES AG0 citations48
US11410906B2Aug 9, 2022
Semiconductor package and method for fabricating a semiconductor package
INFINEON TECHNOLOGIES AG0 citations46
US7902062B2Mar 8, 2011
Electrodepositing a metal in integrated circuit applications
INFINEON TECHNOLOGIES AG0 citations38