Inventor

YOON JU HOON

KR32 patents

⚠️ This page may combine multiple inventors who share the name “YOON JU HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOON JU HOON

AMKOR TECHNOLOGY INC

Exposed die overmolded flip chip package and fabrication method

Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques

Circuit pattern tape for wafer-scale production of chip size semiconductor packages

Electronic device package and fabricating method thereof

Package of finger print sensor and fabricating method thereof

Exposed die overmolded flip chip package and fabrication method

Method for laminating circuit pattern tape on semiconductor wafer

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

Semiconductor device using EMC wafer support system and fabricating method thereof

Package of finger print sensor and fabricating method thereof

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package

Semiconductor device using EMC wafer support system and fabricating method thereof

Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Laser assisted bonding for semiconductor die interconnections

Stacked semiconductor package and manufacturing method thereof

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor device using EMC wafer support system and fabricating method thereof

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

Electronic device package and fabricating method thereof

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device and manufacturing method thereof

ANAM SEMICONDUCTOR INC

Lead end grid array semiconductor package

Grid array type lead frame having lead ends in different planes

DARVEAUX ROBERT FRANCIS

Exposed die overmolded flip chip package method