Inventor
TSUYUNO NOBUTAKE
JP40 patents
⚠️ This page may combine multiple inventors who share the name “TSUYUNO NOBUTAKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI AUTOMOTIVE SYSTEMS LTD
12 patentsUS10818573B2Oct 27, 2020
Power semiconductor module with heat dissipation plate
HITACHI AUTOMOTIVE SYSTEMS LTD2 citations73
US9497873B2Nov 15, 2016
Power module including first and second sealing resins
HITACHI AUTOMOTIVE SYSTEMS LTD4 citations73
US10763190B2Sep 1, 2020
Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device
HITACHI AUTOMOTIVE SYSTEMS LTD2 citations72
US9852962B2Dec 26, 2017
Waterproof electronic device and manufacturing method thereof
HITACHI AUTOMOTIVE SYSTEMS LTD3 citations69
US11469160B2Oct 11, 2022
Power module with active elements and intermediate electrode that connects conductors
HITACHI AUTOMOTIVE SYSTEMS LTD1 citations62
US10194563B2Jan 29, 2019
Power conversion device
HITACHI AUTOMOTIVE SYSTEMS LTD1 citations62
US10699917B2Jun 30, 2020
Resin-sealed vehicle-mounted control device
HITACHI AUTOMOTIVE SYSTEMS LTD0 citations52
US10068880B2Sep 4, 2018
Power module
HITACHI AUTOMOTIVE SYSTEMS LTD1 citations52
US11232994B2Jan 25, 2022
Power semiconductor device having a distance regulation portion and power conversion apparatus including the same
HITACHI AUTOMOTIVE SYSTEMS LTD0 citations51
US10186473B2Jan 22, 2019
Power module
HITACHI AUTOMOTIVE SYSTEMS LTD0 citations51
US9591789B2Mar 7, 2017
Power semiconductor module and power module
HITACHI AUTOMOTIVE SYSTEMS LTD1 citations51
US10128164B2Nov 13, 2018
Electronic device and method of manufacturing the electronic device
HITACHI AUTOMOTIVE SYSTEMS LTD1 citations50
HITACHI LTD
11 patentsUS6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US6097100AAug 1, 2000
Resin sealed semiconductor devices and a process for manufacturing the same
HITACHI LTD56 citations94
US8050037B2Nov 1, 2011
Electronic control device using LC module structure
HITACHI LTD15 citations84
US7899602B2Mar 1, 2011
Engine control unit
HITACHI LTD13 citations83
US7679182B2Mar 16, 2010
Power module and motor integrated control unit
HITACHI LTD9 citations83
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US9373558B2Jun 21, 2016
Resin-sealed electronic control device
HITACHI LTD3 citations73
US7298039B2Nov 20, 2007
Electronic circuit device
HITACHI LTD2 citations63
US12469755B2Nov 11, 2025
Power module and power conversion device using the same
HITACHI LTD0 citations62
US12095382B2Sep 17, 2024
Semiconductor device, electric power conversion device, and manufacturing method of semiconductor device
HITACHI LTD0 citations62
US10177084B2Jan 8, 2019
Semiconductor module and method of manufacturing semiconductor module
HITACHI LTD0 citations42
HITACHI ASTEMO LTD
7 patentsUS12101915B2Sep 24, 2024
Power module, power conversion device, and method for manufacturing power module
HITACHI ASTEMO LTD2 citations73
US11961780B2Apr 16, 2024
Semiconductor module, power conversion device, and manufacturing method of semiconductor module
HITACHI ASTEMO LTD1 citations62
US11367670B2Jun 21, 2022
Power semiconductor device and manufacturing method of the same
HITACHI ASTEMO LTD1 citations62
US11367671B2Jun 21, 2022
Power semiconductor device
HITACHI ASTEMO LTD1 citations59
US12506133B2Dec 23, 2025
Electric circuit body, power conversion device, and method for manufacturing electric circuit body
HITACHI ASTEMO LTD0 citations52
US12599027B2Apr 7, 2026
Electric circuit body and power conversion device
HITACHI ASTEMO LTD0 citations51
US12506046B2Dec 23, 2025
Electric circuit body, power converter, and method for manufacturing electric circuit body
HITACHI ASTEMO LTD0 citations51
RENESAS TECH CORP
3 patentsUS6888230B1May 3, 2005
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP16 citations92
US7202570B2Apr 10, 2007
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
RENESAS TECH CORP6 citations73
US7217992B2May 15, 2007
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP3 citations63
IDE EIICHI
2 patentsTSUYUNO NOBUTAKE
2 patentsUS8723306B2May 13, 2014
Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method
TSUYUNO NOBUTAKE3 citations59
US8339795B2Dec 25, 2012
Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus
TSUYUNO NOBUTAKE0 citations45