Inventor
DO WON CHUL
KR69 patents
⚠️ This page may combine multiple inventors who share the name “DO WON CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
26 patentsUS8362612B1Jan 29, 2013
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC53 citations97
US9349681B1May 24, 2016
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC16 citations93
US9941180B2Apr 10, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC28 citations92
US9391043B2Jul 12, 2016
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC12 citations92
US9048125B2Jun 2, 2015
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC20 citations92
US7042068B2May 9, 2006
Leadframe and semiconductor package made using the leadframe
AMKOR TECHNOLOGY INC32 citations92
US7138707B1Nov 21, 2006
Semiconductor package including leads and conductive posts for providing increased functionality
AMKOR TECHNOLOGY INC20 citations90
US10714378B2Jul 14, 2020
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations84
US10297466B2May 21, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC4 citations84
US10283400B1May 7, 2019
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC11 citations84
US10090234B2Oct 2, 2018
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC4 citations84
US9966276B2May 8, 2018
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations84
US9966300B1May 8, 2018
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC13 citations84
US9553041B1Jan 24, 2017
Semiconductor device package and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations84
US9536858B2Jan 3, 2017
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC3 citations84
US9437575B1Sep 6, 2016
Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives
AMKOR TECHNOLOGY INC8 citations84
US10410967B1Sep 10, 2019
Electronic device comprising a conductive pad on a protruding-through electrode
AMKOR TECHNOLOGY INC3 citations83
US10475770B2Nov 12, 2019
Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof
AMKOR TECHNOLOGY INC6 citations82
US10388582B2Aug 20, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC5 citations82
US10340244B2Jul 2, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC7 citations82
US10867956B2Dec 15, 2020
Method of manufacturing a semiconductor device
AMKOR TECHNOLOGY INC4 citations73
US8981572B1Mar 17, 2015
Conductive pad on protruding through electrode semiconductor device
AMKOR TECHNOLOGY INC3 citations73
US10679952B2Jun 9, 2020
Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations72
US9728514B2Aug 8, 2017
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC1 citations62
US9524906B1Dec 20, 2016
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations62
US9431323B1Aug 30, 2016
Conductive pad on protruding through electrode
AMKOR TECHNOLOGY INC2 citations62
AMKOR TECH SINGAPORE HOLDING PTE LTD
16 patentsUS11562964B2Jan 24, 2023
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD5 citations73
US11424155B2Aug 23, 2022
Semiconductor device package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD4 citations73
US11574890B2Feb 7, 2023
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US11881458B2Jan 23, 2024
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US11018107B2May 25, 2021
Semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US12136565B2Nov 5, 2024
Semiconductor device package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US11501978B2Nov 15, 2022
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US10985031B2Apr 20, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US12080682B2Sep 3, 2024
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11948808B2Apr 2, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11527496B2Dec 13, 2022
Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11195726B2Dec 7, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11043458B2Jun 22, 2021
Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12500199B2Dec 16, 2025
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12444690B2Oct 14, 2025
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12033970B2Jul 9, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
DO WON CHUL
3 patentsUS9000586B2Apr 7, 2015
Semiconductor device and manufacturing method thereof
DO WON CHUL49 citations97
US8552548B1Oct 8, 2013
Conductive pad on protruding through electrode semiconductor device
DO WON CHUL31 citations94
US8487445B1Jul 16, 2013
Semiconductor device having through electrodes protruding from dielectric layer
DO WON CHUL20 citations90
KELLY MICHAEL G
3 patentsUS9136159B2Sep 15, 2015
Method and system for a semiconductor for device package with a die-to-packaging substrate first bond
KELLY MICHAEL G6 citations84
US9040349B2May 26, 2015
Method and system for a semiconductor device package with a die to interposer wafer first bond
KELLY MICHAEL G5 citations84
US8796072B2Aug 5, 2014
Method and system for a semiconductor device package with a die-to-die first bond
KELLY MICHAEL G11 citations84
PAEK JONG SIK
1 patentAHN BYUNG HOON
1 patentShowing the top 50 of 69 patents by PatentIndex Score.