P

Inventor

SIONG CHIN TECK

MY8 patents
⚠️ This page may combine multiple inventors who share the name “SIONG CHIN TECK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAU TECK BENG

3 patents
US8809078B1Aug 19, 2014

Solar powered IC chip

LAU TECK BENG4 citations69
US8778704B1Jul 15, 2014

Solar powered IC chip

LAU TECK BENG6 citations68
US9287236B2Mar 15, 2016

Flexible packaged integrated circuit

LAU TECK BENG0 citations48

NXP USA INC

2 patents
US11056457B2Jul 6, 2021

Semiconductor device with bond wire reinforcement structure

NXP USA INC2 citations72
US10325826B1Jun 18, 2019

Substrate with reservoir for die attach adhesive

NXP USA INC0 citations43

NXP BV

1 patent
US12288770B2Apr 29, 2025

Semiconductor packages with embedded wiring on re-distributed bumps

NXP BV2 citations69

FREESCALE SEMICONDUCTOR INC

1 patent
US9257403B2Feb 9, 2016

Copper ball bond interface structure and formation

FREESCALE SEMICONDUCTOR INC0 citations43

SIONG CHIN TECK

1 patent
US9165904B1Oct 20, 2015

Insulated wire bonding with EFO before second bond

SIONG CHIN TECK0 citations42