Inventor

DERDERIAN JAMES M

US55 patents

⚠️ This page may combine multiple inventors who share the name “DERDERIAN JAMES M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DERDERIAN JAMES M

MICRON TECHNOLOGY INC

Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods

Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Substrate thinning including planarization

Thinned, strengthened semiconductor substrates and packages including same

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Flip-chip image sensor packages and methods of fabricating the same

Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween

Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods

Die package having an adhesive flow restriction area

Semiconductor device test apparatuses

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

Bonding pads with thermal pathways

Interconnect structure with improved conductive properties and associated systems and methods

Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods

Methods of manufacturing imaging device packages

Carrier removal by use of multilayer foil

Bonding pads with thermal pathways

Bonding pads with thermal pathways

Semiconductor device test apparatuses comprising at least one test site having an array of pockets

Bonding pads with thermal pathways

Methods for processing semiconductor dice and fabricating assemblies incorporating same

Interconnect structure with improved conductive properties and associated systems and methods

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Semiconductor substrate

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Process for strengthening semiconductor substrates following thinning

Systems for thermally treating conductive elements on semiconductor and wafer structures

Methods and apparatuses for reflowing conductive elements of semiconductor devices

Methods of testing semiconductor devices comprising a die stack having protruding conductive elements

Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

Bonding pads with thermal pathways

Die package having an adhesive flow restriction area

Substrate with enhanced properties for planarization

Solder mask fault fiber optics sensor

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Methods for processing semiconductor dice and fabricating assemblies incorporating same

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Carrier removal by use of multilayer foil

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

APTINA IMAGING CORP

Microelectronic imaging units

Microelectronic imaging units having covered image sensors

Methods of manufacturing microelectronic imaging units on a microfeature workpiece

DERDERIAN JAMES M

Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween