Inventor
TRICKETT YING
US3 patents
Patents
3 patentsUS10861744B2Dec 8, 2020
Platform and method of operating for integrated end-to-end CMP-less interconnect process
TOKYO ELECTRON LTD7 citations82
US12237216B2Feb 25, 2025
Method for filling recessed features in semiconductor devices with a low-resistivity metal
TOKYO ELECTRON LTD0 citations50
US10008564B2Jun 26, 2018
Method of corner rounding and trimming of nanowires by microwave plasma
TOKYO ELECTRON LTD0 citations50