Inventor
BAE JOHYUN
KR23 patents
⚠️ This page may combine multiple inventors who share the name “BAE JOHYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
6 patentsUS7923304B2Apr 12, 2011
Integrated circuit packaging system with conductive pillars and method of manufacture thereof
STATS CHIPPAC LTD61 citations97
US7800212B2Sep 21, 2010
Mountable integrated circuit package system with stacking interposer
STATS CHIPPAC LTD24 citations92
US7687897B2Mar 30, 2010
Mountable integrated circuit package-in-package system with adhesive spacing structures
STATS CHIPPAC LTD19 citations92
US7710735B2May 4, 2010
Multichip package system
STATS CHIPPAC LTD2 citations53
US8039275B1Oct 18, 2011
Integrated circuit packaging system with rounded interconnect and method of manufacture thereof
STATS CHIPPAC LTD1 citations52
US7884457B2Feb 8, 2011
Integrated circuit package system with dual side connection
STATS CHIPPAC LTD0 citations51
BAE JOHYUN
4 patentsUS8698297B2Apr 15, 2014
Integrated circuit packaging system with stack device
BAE JOHYUN6 citations82
US9349666B1May 24, 2016
Integrated circuit packaging system with package stacking
BAE JOHYUN0 citations51
US8461680B2Jun 11, 2013
Integrated circuit packaging system with rounded interconnect
BAE JOHYUN0 citations51
US8643181B2Feb 4, 2014
Integrated circuit packaging system with encapsulation and method of manufacture thereof
BAE JOHYUN1 citations49
JANG KI YOUN
3 patentsUS8304900B2Nov 6, 2012
Integrated circuit packaging system with stacked lead and method of manufacture thereof
JANG KI YOUN120 citations97
US8772916B2Jul 8, 2014
Integrated circuit package system employing mold flash prevention technology
JANG KI YOUN2 citations62
US8252615B2Aug 28, 2012
Integrated circuit package system employing mold flash prevention technology
JANG KI YOUN3 citations62