Inventor
LEE JAE-DONG
KR39 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS6914001B2Jul 5, 2005
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
SAMSUNG ELECTRONICS CO LTD20 citations93
US6863592B2Mar 8, 2005
Chemical/mechanical polishing slurry and chemical mechanical polishing method using the same
SAMSUNG ELECTRONICS CO LTD26 citations93
US6887137B2May 3, 2005
Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
SAMSUNG ELECTRONICS CO LTD28 citations92
US6517412B2Feb 11, 2003
Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same
SAMSUNG ELECTRONICS CO LTD40 citations92
US6540935B2Apr 1, 2003
Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
SAMSUNG ELECTRONICS CO LTD30 citations90
US8043970B2Oct 25, 2011
Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD15 citations83
US7338352B2Mar 4, 2008
Slurry delivery system, chemical mechanical polishing apparatus and method for using the same
SAMSUNG ELECTRONICS CO LTD9 citations82
US6855267B2Feb 15, 2005
Chemical mechanical polishing slurry
SAMSUNG ELECTRONICS CO LTD10 citations74
US6514862B2Feb 4, 2003
Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US7442646B2Oct 28, 2008
Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry
SAMSUNG ELECTRONICS CO LTD6 citations63
US7247256B2Jul 24, 2007
CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method
SAMSUNG ELECTRONICS CO LTD2 citations63
US7144815B2Dec 5, 2006
Chemical mechanical polishing slurry
SAMSUNG ELECTRONICS CO LTD2 citations63
US7144301B2Dec 5, 2006
Method and system for planarizing integrated circuit material
SAMSUNG ELECTRONICS CO LTD2 citations63
US6875997B2Apr 5, 2005
Test patterns and methods of controlling CMP process using the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7244649B2Jul 17, 2007
Method of manufacturing a capacitor having improved capacitance and method of manufacturing a semiconductor device including the capacitor
SAMSUNG ELECTRONICS CO LTD5 citations62
US6858452B2Feb 22, 2005
Method for isolating self-aligned contact pads
SAMSUNG ELECTRONICS CO LTD6 citations62
US8018078B2Sep 13, 2011
Photo key and method of fabricating semiconductor device using the photo key
SAMSUNG ELECTRONICS CO LTD1 citations52
US7294516B2Nov 13, 2007
Test patterns and methods of controlling CMP process using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7718535B2May 18, 2010
Slurry compositions and CMP methods using the same
SAMSUNG ELECTRONICS CO LTD1 citations49
US8048808B2Nov 1, 2011
Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the same
SAMSUNG ELECTRONICS CO LTD0 citations41
US7498263B2Mar 3, 2009
Method of planarizing an inter-metal insulation film
SAMSUNG ELECTRONICS CO LTD0 citations40
HYUNDAI ELECTRONICS IND
4 patentsUS6380568B1Apr 30, 2002
CMOS image sensor and method for fabricating the same
HYUNDAI ELECTRONICS IND19 citations92
US6215142B1Apr 10, 2001
Analog semiconductor device and method of fabricating the same
HYUNDAI ELECTRONICS IND21 citations91
US6410901B1Jun 25, 2002
Image sensor having blooming effect preventing circuitry
HYUNDAI ELECTRONICS IND11 citations74
US6518115B2Feb 11, 2003
CMOS image sensor and method for fabricating the same
HYUNDAI ELECTRONICS IND6 citations73
INHA IND PARTNERSHIP INST
2 patentsUS7440977B2Oct 21, 2008
Recovery method using extendible hashing-based cluster logs in shared-nothing spatial database cluster
INHA IND PARTNERSHIP INST10 citations80
US7634487B2Dec 15, 2009
System and method for index reorganization using partial index transfer in spatial data warehouse
INHA IND PARTNERSHIP INST6 citations56