P

Inventor

LEE JAE-DONG

KR39 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

21 patents
US6914001B2Jul 5, 2005

Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same

SAMSUNG ELECTRONICS CO LTD20 citations93
US6863592B2Mar 8, 2005

Chemical/mechanical polishing slurry and chemical mechanical polishing method using the same

SAMSUNG ELECTRONICS CO LTD26 citations93
US6887137B2May 3, 2005

Chemical mechanical polishing slurry and chemical mechanical polishing method using the same

SAMSUNG ELECTRONICS CO LTD28 citations92
US6517412B2Feb 11, 2003

Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same

SAMSUNG ELECTRONICS CO LTD40 citations92
US6540935B2Apr 1, 2003

Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same

SAMSUNG ELECTRONICS CO LTD30 citations90
US8043970B2Oct 25, 2011

Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD15 citations83
US7338352B2Mar 4, 2008

Slurry delivery system, chemical mechanical polishing apparatus and method for using the same

SAMSUNG ELECTRONICS CO LTD9 citations82
US6855267B2Feb 15, 2005

Chemical mechanical polishing slurry

SAMSUNG ELECTRONICS CO LTD10 citations74
US6514862B2Feb 4, 2003

Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US7442646B2Oct 28, 2008

Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry

SAMSUNG ELECTRONICS CO LTD6 citations63
US7247256B2Jul 24, 2007

CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method

SAMSUNG ELECTRONICS CO LTD2 citations63
US7144815B2Dec 5, 2006

Chemical mechanical polishing slurry

SAMSUNG ELECTRONICS CO LTD2 citations63
US7144301B2Dec 5, 2006

Method and system for planarizing integrated circuit material

SAMSUNG ELECTRONICS CO LTD2 citations63
US6875997B2Apr 5, 2005

Test patterns and methods of controlling CMP process using the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US7244649B2Jul 17, 2007

Method of manufacturing a capacitor having improved capacitance and method of manufacturing a semiconductor device including the capacitor

SAMSUNG ELECTRONICS CO LTD5 citations62
US6858452B2Feb 22, 2005

Method for isolating self-aligned contact pads

SAMSUNG ELECTRONICS CO LTD6 citations62
US8018078B2Sep 13, 2011

Photo key and method of fabricating semiconductor device using the photo key

SAMSUNG ELECTRONICS CO LTD1 citations52
US7294516B2Nov 13, 2007

Test patterns and methods of controlling CMP process using the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7718535B2May 18, 2010

Slurry compositions and CMP methods using the same

SAMSUNG ELECTRONICS CO LTD1 citations49
US8048808B2Nov 1, 2011

Slurry compositions for polishing metal, methods of polishing a metal object and methods of forming a metal wiring using the same

SAMSUNG ELECTRONICS CO LTD0 citations41
US7498263B2Mar 3, 2009

Method of planarizing an inter-metal insulation film

SAMSUNG ELECTRONICS CO LTD0 citations40

HYUNDAI ELECTRONICS IND

4 patents

INHA IND PARTNERSHIP INST

2 patents

DOOSAN INFRACORE CO LTD

1 patent

HYNIX SEMICONDUCTOR INC

1 patent

KWON BYOUNG-HO

1 patent

LEE JONG-WON

1 patent

KANG DAE-HYUK

1 patent

RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV

1 patent

DRTECH CORP

1 patent

UNIV INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIV

1 patent

HD HYUNDAI INFRACORE CO LTD

1 patent

SAMSUNG ELECTRONICS CO L T D

1 patent

JUNG SOON-CHUL

1 patent

PARK DONG-SUK

1 patent