Inventor
NISHIZAWA KOICHIRO
JP16 patents
⚠️ This page may combine multiple inventors who share the name “NISHIZAWA KOICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
12 patentsUS10854523B2Dec 1, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP2 citations72
US9576845B2Feb 21, 2017
Method for manufacturing a semiconductor device including a hollow structure around an electrode of a semiconductor element
MITSUBISHI ELECTRIC CORP3 citations72
US12033905B2Jul 9, 2024
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations60
US11244874B2Feb 8, 2022
Substrate bonding structure and substrate bonding method
MITSUBISHI ELECTRIC CORP0 citations60
US10304730B2May 28, 2019
Semiconductor device having a Pd-containing adhesion layer
MITSUBISHI ELECTRIC CORP1 citations60
US10020246B2Jul 10, 2018
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US10950567B2Mar 16, 2021
Hollow sealed device and manufacturing method therefor
MITSUBISHI ELECTRIC CORP0 citations50
US9887131B2Feb 6, 2018
Semiconductor device having a Pd-containing adhesion layer
MITSUBISHI ELECTRIC CORP1 citations50
US9048295B2Jun 2, 2015
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations48
US9922836B2Mar 20, 2018
Semiconductor device manufacturing method and semiconductor device
MITSUBISHI ELECTRIC CORP0 citations44
US9887284B1Feb 6, 2018
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations41
US10224294B2Mar 5, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations39