Inventor
UTOMO HENRY K
US62 patents
⚠️ This page may combine multiple inventors who share the name “UTOMO HENRY K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
34 patentsUS7071103B2Jul 4, 2006
Chemical treatment to retard diffusion in a semiconductor overlayer
IBM120 citations97
US7135724B2Nov 14, 2006
Structure and method for making strained channel field effect transistor using sacrificial spacer
IBM47 citations96
US8928086B2Jan 6, 2015
Strained finFET with an electrically isolated channel
IBM19 citations93
US7781800B2Aug 24, 2010
Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer
IBM24 citations93
US7176481B2Feb 13, 2007
In situ doped embedded sige extension and source/drain for enhanced PFET performance
IBM52 citations92
US10109675B2Oct 23, 2018
Forming self-aligned contacts on pillar structures
IBM6 citations84
US9190406B2Nov 17, 2015
Fin field effect transistors having heteroepitaxial channels
IBM7 citations84
US9190520B2Nov 17, 2015
Strained finFET with an electrically isolated channel
IBM15 citations84
US9082851B2Jul 14, 2015
FinFET having suppressed leakage current
IBM15 citations84
US8927408B2Jan 6, 2015
Self-aligned contact employing a dielectric metal oxide spacer
IBM6 citations84
US7960798B2Jun 14, 2011
Structure and method to form multilayer embedded stressors
IBM11 citations84
US7618866B2Nov 17, 2009
Structure and method to form multilayer embedded stressors
IBM11 citations84
US7504336B2Mar 17, 2009
Methods for forming CMOS devices with intrinsically stressed metal silicide layers
IBM16 citations84
US7446350B2Nov 4, 2008
Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer
IBM9 citations84
US10557779B2Feb 11, 2020
Semiconductor manufactured nano-structures for microbe or virus trapping or destruction
IBM4 citations83
US7645656B2Jan 12, 2010
Structure and method for making strained channel field effect transistor using sacrificial spacer
IBM7 citations74
US7482209B2Jan 27, 2009
Hybrid orientation substrate and method for fabrication of thereof
IBM6 citations74
US10777735B2Sep 15, 2020
Contact via structures
IBM2 citations73
US10243077B2Mar 26, 2019
FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
IBM2 citations73
US9917190B2Mar 13, 2018
FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
IBM2 citations73
US9818877B2Nov 14, 2017
Embedded source/drain structure for tall finFET and method of formation
IBM4 citations73
US9312364B2Apr 12, 2016
finFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
IBM3 citations73
US9029913B2May 12, 2015
Silicon-germanium fins and silicon fins on a bulk substrate
IBM5 citations73
US10393635B2Aug 27, 2019
Semiconductor manufactured nano-structures for microbe or virus trapping or destruction
IBM2 citations72
US10246730B2Apr 2, 2019
Semiconductor manufactured nano-structures for microbe or virus trapping or destruction
IBM3 citations72
US10686124B2Jun 16, 2020
Contact via structures
IBM1 citations63
US8933528B2Jan 13, 2015
Semiconductor fin isolation by a well trapping fin portion
IBM2 citations63
US11150168B2Oct 19, 2021
Semiconductor manufactured nano-structures for microbe or virus trapping or destruction
IBM0 citations62
US11081583B2Aug 3, 2021
FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
IBM0 citations62
US11060960B2Jul 13, 2021
Semiconductor manufactured nano-structures for microbe or virus trapping or destruction
IBM0 citations62
US10896976B2Jan 19, 2021
Embedded source/drain structure for tall FinFet and method of formation
IBM0 citations62
US10559690B2Feb 11, 2020
Embedded source/drain structure for tall FinFET and method of formation
IBM1 citations62
US10615279B2Apr 7, 2020
FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
IBM0 citations52
US10586920B2Mar 10, 2020
Forming self-aligned contacts on pillar structures
IBM0 citations52
GLOBALFOUNDRIES INC
8 patentsUS9627480B2Apr 18, 2017
Junction butting structure using nonuniform trench shape
GLOBALFOUNDRIES INC13 citations84
US9577100B2Feb 21, 2017
FinFET and nanowire semiconductor devices with suspended channel regions and gate structures surrounding the suspended channel regions
GLOBALFOUNDRIES INC17 citations84
US9536900B2Jan 3, 2017
Forming fins of different semiconductor materials on the same substrate
GLOBALFOUNDRIES INC7 citations84
US9634084B1Apr 25, 2017
Conformal buffer layer in source and drain regions of fin-type transistors
GLOBALFOUNDRIES INC12 citations81
US10049942B2Aug 14, 2018
Asymmetric semiconductor device and method of forming same
GLOBALFOUNDRIES INC5 citations73
US9577099B2Feb 21, 2017
Diamond shaped source drain epitaxy with underlying buffer layer
GLOBALFOUNDRIES INC2 citations73
US9680019B1Jun 13, 2017
Fin-type field-effect transistors with strained channels
GLOBALFOUNDRIES INC3 citations72
US9875939B1Jan 23, 2018
Methods of forming uniform and pitch independent fin recess
GLOBALFOUNDRIES INC5 citations71
UTOMO HENRY K
4 patentsUS8138053B2Mar 20, 2012
Method of forming source and drain of field-effect-transistor and structure thereof
UTOMO HENRY K12 citations83
US8492286B2Jul 23, 2013
Method of forming E-fuse in replacement metal gate manufacturing process
UTOMO HENRY K9 citations82
US8236637B2Aug 7, 2012
Planar silicide semiconductor structure
UTOMO HENRY K7 citations81
US8420491B2Apr 16, 2013
Structure and method for replacement metal gate field effect transistors
UTOMO HENRY K7 citations80
LI YING
1 patentYANG JONG HO
1 patentST MICROELECTRONICS INC
1 patentSHANG HUILING
1 patentShowing the top 50 of 62 patents by PatentIndex Score.