Inventor
CHAO YING-CHEN
TW24 patents
⚠️ This page may combine multiple inventors who share the name “CHAO YING-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
20 patentsUS5478762ADec 26, 1995
Method for producing patterning alignment marks in oxide
TAIWAN SEMICONDUCTOR MFG275 citations99
US5790417AAug 4, 1998
Method of automatic dummy layout generation
TAIWAN SEMICONDUCTOR MFG262 citations96
US6024831AFeb 15, 2000
Method and apparatus for monitoring plasma chamber condition by observing plasma stability
TAIWAN SEMICONDUCTOR MFG27 citations92
US5989754ANov 23, 1999
Photomask arrangement protecting reticle patterns from electrostatic discharge damage (ESD)
TAIWAN SEMICONDUCTOR MFG48 citations92
US5726497AMar 10, 1998
Upward plug filled via hole device
TAIWAN SEMICONDUCTOR MFG27 citations92
US5674357AOct 7, 1997
Semiconductor substrate cleaning process
TAIWAN SEMICONDUCTOR MFG31 citations91
US5413940AMay 9, 1995
Process of treating SOG layer using end-point detector for outgassing
TAIWAN SEMICONDUCTOR MFG43 citations91
US5807787ASep 15, 1998
Method for reducing surface leakage current on semiconductor intergrated circuits during polyimide passivation
TAIWAN SEMICONDUCTOR MFG40 citations89
US5757060AMay 26, 1998
Contamination guard ring for semiconductor integrated circuit applications
TAIWAN SEMICONDUCTOR MFG22 citations89
US5567643AOct 22, 1996
Method of forming contamination guard ring for semiconductor integrated circuit applications
TAIWAN SEMICONDUCTOR MFG29 citations89
US5591673AJan 7, 1997
Tungsten stud process for stacked via applications
TAIWAN SEMICONDUCTOR MFG32 citations88
US6604853B2Aug 12, 2003
Accelerated thermal stress cycle test
TAIWAN SEMICONDUCTOR MFG22 citations86
US5780315AJul 14, 1998
Dry etch endpoint method
TAIWAN SEMICONDUCTOR MFG18 citations83
US5385868AJan 31, 1995
Upward plug process for metal via holes
TAIWAN SEMICONDUCTOR MFG17 citations82
US5999397ADec 7, 1999
Method for preventing electrostatic discharge damage to an insulating article
TAIWAN SEMICONDUCTOR MFG13 citations74
US5693976ADec 2, 1997
MOSFET device having denuded zones for forming alignment marks
TAIWAN SEMICONDUCTOR MFG9 citations74
US5668401ASep 16, 1997
Chessboard pattern layout for scribe lines
TAIWAN SEMICONDUCTOR MFG11 citations74
US5685947ANov 11, 1997
Chemical-mechanical polishing with an embedded abrasive
TAIWAN SEMICONDUCTOR MFG8 citations73
US5798192AAug 25, 1998
Structure of a mask for use in a lithography process of a semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG13 citations72
US6176141B1Jan 23, 2001
Method for stud pull test for film formed on semiconductor device
TAIWAN SEMICONDUCTOR MFG12 citations70
TSMC SOLAR LTD
3 patentsUS9929304B2Mar 27, 2018
Method and system for forming absorber layer on metal coated glass for photovoltaic devices
TSMC SOLAR LTD0 citations51
US9103032B2Aug 11, 2015
Apparatus and method for forming thin films in solar cells
TSMC SOLAR LTD1 citations51
US9029737B2May 12, 2015
Method and system for forming absorber layer on metal coated glass for photovoltaic devices
TSMC SOLAR LTD0 citations51