Inventor
TANDY WILLIAM D
US11 patents
⚠️ This page may combine multiple inventors who share the name “TANDY WILLIAM D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
10 patentsUS6734032B2May 11, 2004
Method and apparatus for marking a bare semiconductor die
MICRON TECHNOLOGY INC44 citations96
US6692978B2Feb 17, 2004
Methods for marking a bare semiconductor die
MICRON TECHNOLOGY INC41 citations96
US6524881B1Feb 25, 2003
Method and apparatus for marking a bare semiconductor die
MICRON TECHNOLOGY INC67 citations96
US7238543B2Jul 3, 2007
Methods for marking a bare semiconductor die including applying a tape having energy-markable properties
MICRON TECHNOLOGY INC14 citations92
US7094618B2Aug 22, 2006
Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
MICRON TECHNOLOGY INC25 citations92
US7095097B2Aug 22, 2006
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC6 citations73
US6887740B2May 3, 2005
Method for making an integrated circuit package having reduced bow
MICRON TECHNOLOGY INC4 citations73
US6577018B1Jun 10, 2003
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC3 citations62
US7186589B2Mar 6, 2007
Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
MICRON TECHNOLOGY INC2 citations60
US7344921B2Mar 18, 2008
Integrated circuit device having reduced bow and method for making same
MICRON TECHNOLOGY INC0 citations52