Inventor

CHEN U-TING

TW24 patents

⚠️ This page may combine multiple inventors who share the name “CHEN U-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN U-TING

TAIWAN SEMICONDUCTOR MFG CO LTD

3DIC interconnect apparatus and method

3DIC interconnect apparatus and method

Interconnect structure for connecting dies and methods of forming the same

3DIC interconnect apparatus and method

BSI image sensor and method of forming same

Method of manufacturing semiconductor devices having conductive plugs with varying widths

Stacked image sensor having a barrier layer

BSI image sensor and method of forming same

BSI image sensor and method of forming same

3DIC interconnect apparatus and method

3DIC interconnect apparatus and method

Semiconductor devices and methods of manufacture thereof

BSI image sensor and method of forming same

Stacked image sensor having a barrier layer

3DIC interconnect apparatus and method

Stacked image sensor having a barrier layer

3DIC interconnect apparatus and method

Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods

Interconnect structure for connecting dies and methods of forming the same

BSI image sensor and method of forming same

TAIWAN SEMICONDUCTOR MFG

Interconnect structure and method

Interconnect structure for connecting dies and methods of forming the same

CHEN U-TING

Scribe lines in wafers

Image device and methods of forming the same