Inventor

DING HANYI

US112 patents

⚠️ This page may combine multiple inventors who share the name “DING HANYI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DING HANYI

IBM

Vertical LC tank device

Vertical LC tank device

On-chip inductor with magnetic core

Through wafer via and method of making same

Millimeter wave phase shifters using tunable transmission lines

Millimeter wave phase shifters using tunable transmission lines

Method, structure, and design structure for a through-silicon-via Wilkinson power divider

Millimeter wave phase shifters using tunable transmission lines

Coplanar waveguide for stacked multi-chip systems

Through wafer vias and method of making same

Integrated millimeter wave antenna and transceiver on a substrate

Method for forming an on-chip high frequency electro-static discharge device

Integrated parallel plate capacitors

On-chip inductor with magnetic core

Multiple layer structure for substrate noise isolation

Structure, system and method for device radio frequency (RF) reliability

Methods of fabricating coplanar waveguide structures

Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors

Design structure for an on-chip high frequency electro-static discharge device

Structure and method for in-line defect non-contact tests

Reconfigurable rat race coupler

Integrated circuit pad modeling

High power radio frequency (RF) in-line wafer testing

Radiation signal measurement system for millimeter wave transceivers

DING HANYI

Integrated millimeter wave antenna and transceiver on a substrate

Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance

Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures

Through wafer vias and method of making same

Structure of very high insertion loss of the substrate noise decoupling

Structure for an on-chip high frequency electro-static discharge device

Integrated millimeter wave antenna and transceiver on a substrate

Test structure for determination of TSV depth

Compact on-chip branchline coupler using slow wave transmission line

Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance

Load tolerant voltage controlled oscillator (VCO), IC and CMOS IC including the VCO

High frequency quadrature PLL circuit and method

On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors

Circuit structure and design structure for an optionally switchable on-chip slow wave transmission line band-stop filter and a method of manufacture

High-frequency cobra probe

On-chip tunable transmission lines, methods of manufacture and design structures

Reconfigurable Wilkinson power divider and design structure thereof

Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate

Through wafer vias and method of making same

GLOBALFOUNDRIES US INC

Integrated circuit structure with optical absorber layer over optical grating coupler

Integrated circuit structure with optical absorber layer over optical grating coupler

Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer

GLOBALFOUNDRIES INC

Frequency-locked voltage regulated loop

Device structures for a silicon-on-insulator substrate with a high-resistance handle wafer

SUN PINPING

Low phase variation CMOS digital attenuator

WOODS JR WAYNE H

Millimeter-wave on-chip switch employing frequency-dependent inductance for cancellation of off-state capacitance