Inventor

HE ZHONG-XIANG

US161 patents

⚠️ This page may combine multiple inventors who share the name “HE ZHONG-XIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HE ZHONG-XIANG

IBM

CMOS imager array with recessed dielectric

Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure

Integrated BEOL thin film resistor

Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit

Vertical LC tank device

Terminal pad structures and methods of fabricating same

Vertical LC tank device

Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme

On-chip inductor with magnetic core

Metal-insulator-metal capacitor and method of fabrication

Passive components in the back end of integrated circuits

Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric

Method for making a dielectric region in a bulk silicon substrate providing a high-Q passive resonator

Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors

Interdigitated vertical parallel capacitor

Integrated millimeter wave antenna and transceiver on a substrate

Structures including means for lateral current carrying capability improvement in semiconductor devices

Method for forming an on-chip high frequency electro-static discharge device

Integrated parallel plate capacitors

Terminal pad structures and methods of fabricating same

Integrated BEOL thin film resistor

Post last wiring level inductor using patterned plate process

On-chip inductor with magnetic core

Multiple layer structure for substrate noise isolation

Copper wire and dielectric with air gaps

Interdigitated capacitors with a zero quadratic voltage coefficient of capacitance or zero linear temperature coefficient of capacitance

Optimum padset for wire bonding RF technologies with high-Q inductors

Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask

Passive components in the back end of integrated circuits

Design structure for an on-chip high frequency electro-static discharge device

Tri-metal and dual-metal stacked inductors

GLOBALFOUNDRIES INC

Air gap over transistor gate and related method

Air gap over transistor gate and related method

Segmented guard-ring and chip edge seals

Dielectric cover for a through silicon via

Tight pitch wirings and capacitor(s)

DING HANYI

Integrated millimeter wave antenna and transceiver on a substrate

Structure of very high insertion loss of the substrate noise decoupling

Structure for an on-chip high frequency electro-static discharge device

Integrated millimeter wave antenna and transceiver on a substrate

COLLINS DAVID S

Semiconductor structure having vias and high density capacitors

Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors

DUNBAR III GEORGE A

Planar cavity MEMS and related structures, methods of manufacture and design structures

COONEY III EDWARD C

Structure and method for reducing vertical crack propagation

CHEN FEN

Method for forming thin film resistor and terminal bond pad simultaneously

GAMBINO JEFFREY P

Interlevel conductive light shield

DUNN JAMES S

Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture

COOLBAUGH DOUGLAS D

Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor

DALTON TIMOTHY J

Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit

CHRISMAN GREGORY S

Top corner rounding of damascene wire for insulator crack suppression