Inventor · disambiguated record
Hitoshi Onozeki
Also filed as: ONOZEKI HITOSHI
4 granted patents·3 pending applications·12 citations·filing 2005–2022
63Inventor score
Top patents by PatentIndex Score
7 records- 0180US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0264US2023095879A1Method for using a buffer sheetSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0359US10893616B2Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jan 12, 2021·1 cites·3 claims
- 0458US2018340056A1Buffer sheet composition and buffer sheetHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 0547US2024018306A1Resin composition, method for producing semiconductor device, cured product, semiconductor device, and method for synthesizing polyimide precursorRESONAC CORP·Filed 2021·Application pending·0 cites
- 0637US10051743B2Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring boardONOZEKI HITOSHI·Filed 2008·Granted Aug 14, 2018·0 cites·29 claims
- 0736US11444054B2Semiconductor element mounting structure, and combination of semiconductor element and substrateHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 13, 2022·0 cites·20 claims
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