Inventor

MOON KWANGJIN

KR55 patents

⚠️ This page may combine multiple inventors who share the name “MOON KWANGJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOON KWANGJIN

SAMSUNG ELECTRONICS CO LTD

Semiconductor device

Semiconductor devices

Semiconductor device

Semiconductor device

Semiconductor devices including through vias and methods of fabricating the same

Semiconductor device

Semiconductor devices including a through via structure and methods of forming the same

Semiconductor device including through via structure

Semiconductor device

Semiconductor device and method of fabricating the same

Methods of manufacturing semiconductor devices

Semiconductor device

Semiconductor packages

Semiconductor packages

Semiconductor devices including through vias and methods of fabricating the same

Apparatus for etching substrate bevel and semiconductor fabrication method using the same

Semiconductor devices having through electrodes

Semiconductor chips and methods of forming the same

Semiconductor device

Semiconductor devices having penetration vias

Semiconductor device including penetration via structure

Method of manufacturing a semiconductor device including bonding layer and adsorption layer

Semiconductor devices having penetration vias with portions having decreasing widths

Semiconductor device

Semiconductor devices including bonding layer and adsorption layer

Substrate bonding apparatus and bonding method using the same

Semiconductor device including through via structure

Semiconductor stack and method for manufacturing the same

Semiconductor device including through substrate vias and method of manufacturing the semiconductor device

Semiconductor stack and method for manufacturing the same

Semiconductor device including through substrate vias and method of manufacturing the semiconductor device

Semiconductor packages and methods of manufacturing the semiconductor packages

Semiconductor device

Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages

Semiconductor device and semiconductor package including penetration via structure

Semiconductor device

Integrated circuit semiconductor device including through silicon via

Semiconductor device including bonding enhancement layer and method of forming the same

Semiconductor device including through electrodes

Integrated circuit device with through-electrode and electrode landing pad, and semiconductor package including the same

Semiconductor device

Semiconductor device and semiconductor package

Semiconductor device and method of fabricating the same

LEE DOSUN

Semiconductor devices including through silicon via electrodes and methods of fabricating the same

Semiconductor devices including stress relief structures

LEE HO-JIN

Semiconductor devices with through electrodes and methods of fabricating the same

KANG PIL-KYU

Semiconductor devices having through-electrodes and methods for fabricating the same

PARK JAE-HWA

Semiconductor devices having through-electrodes

MOON KWANGJIN

Semiconductor devices and methods of fabricating the same

BANG SUKCHUL

Semiconductor devices having through electrodes and methods of fabricating the same