Inventor

HSIEH CHENG-CHIEH

TW94 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH CHENG-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH CHENG-CHIEH

TAIWAN SEMICONDUCTOR MFG CO LTD

Fan-out stacked system in package (SIP) having dummy dies and methods of making the same

Thermal structure for integrated circuit package

Contact pad for semiconductor device

Semiconductor structure and method of fabricating the same

Integrated fan-out device, 3D-IC system, and method

Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Semiconductor package for thermal dissipation

Contact pad for semiconductor device

Through silicon via keep out zone formation method and system

Packaging structures and methods with a metal pillar

Semiconductor package for thermal dissipation

Semiconductor device and method of making the same

Multi-terminal inductor for integrated circuit

IPD modules with flexible connection scheme in packaging

Semiconductor package and method of manufacturing the same

Photonic integrated circuit and package structure

Contact pad for semiconductor device

IPD modules with flexible connection scheme in packaging

Semiconductor structure and method of fabricating the same

Package and method of forming same

Semiconductor devices and methods of manufacture

Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap

Semiconductor device and method of manufacturing the same

Package structure, package-on-package structure and method of fabricating the same

Semiconductor devices and methods of forming the same

IPD modules with flexible connection scheme in packaging

Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Contact pad for semiconductor device

Semiconductor package for thermal dissipation

Image sensor device and method

Semiconductor structure and manufacturing method thereof

Semiconductor packaging device with heat sink

Substrateless integrated circuit packages and methods of forming same

Substrateless integrated circuit packages and methods of forming same

Multi-terminal inductor for integrated circuit

Package and method of forming same

Semiconductor device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor package for thermal dissipation

Semiconductor package for thermal dissipation

Package structure and method of forming the same

Die stacking structure and method forming same

TAIWAN SEMICONDUCTOR MFG

3D semiconductor package interposer with die cavity

Package device including an opening in a flexible substrate and methods of forming the same

Through silicon via keep out zone formation method and system

HSIEH CHENG-CHIEH

Through silicon via keep out zone formation along different crystal orientations

Integrated thermal solutions for packaging integrated circuits

Thermal structure for integrated circuit package

JENG SHIN-PUU

3D semiconductor package interposer with die cavity

YU CHEN-HUA

Connector design for packaging integrated circuits