Inventor · disambiguated record
Toshiharu Daii
Also filed as: DAII TOSHIHARU
2 granted patents·3 pending applications·11 citations·filing 2004–2013
55Inventor score
Files withDISCO CORP4
Top patents by PatentIndex Score
5 records- 0172US8025553B2Back grinding method for waferDISCO CORP·Filed 2008·Granted Sep 27, 2011·5 cites·3 claims
- 0270US7682224B2Method of machining substrateDISCO CORP·Filed 2008·Granted Mar 23, 2010·6 cites·4 claims
- 0339US2013203237A1Cutting method for device waferDISCO CORP·Filed 2013·Application pending·0 cites
- 0433US2011097875A1Wafer processing methodDISCO CORP·Filed 2010·Application pending·0 cites
- 0529US2004161940A1Semiconductor wafer processing methodFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →