Inventor · disambiguated record
Francesco La Via
Also filed as: LA VIA FRANCESCO
5 granted patents·4 pending applications·4 citations·filing 2005–2023
65Inventor score
Files withST MICROELECTRONICS SRL4CONSIGLIO NAZIONALE RICERCHE1D ARRIGO GIUSEPPE ALESSIO MARIA1ISTITUTO NAZ FISICA NUCLEARE1MASSIMO CAMARDA1
Top patents by PatentIndex Score
9 records- 0171US11946158B2Apparatus for growing a semiconductor wafer and associated manufacturing processST MICROELECTRONICS SRL·Filed 2023·Granted Apr 2, 2024·0 cites·20 claims
- 0271US8890103B2Semiconductor substrate suitable for the realisation of electronic and/or optoelectronic devices and relative manufacturing processD ARRIGO GIUSEPPE ALESSIO MARIA·Filed 2011·Granted Nov 18, 2014·4 cites·14 claims
- 0358US11692283B2Apparatus for growing a semiconductor wafer and associated manufacturing processST MICROELECTRONICS SRL·Filed 2020·Granted Jul 4, 2023·0 cites·21 claims
- 0453US12376776B1Flexible monolithic all polycrystalline silicon carbide neural interface device and method of manufactureUNIV SOUTH FLORIDA·Filed 2021·Granted Aug 5, 2025·0 cites·3 claims
- 0548US2015031193A1Semiconductor substrate suitable for the realization of electronic and/or optoelectronic devices and relative manufacturing processCONSIGLIO NAZIONALE RICERCHE·Filed 2014·Application pending·0 cites
- 0645US2022172949A1Manufacturing method of a sic wafer with residual stress controlST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 0738US2006183267A1Process for manufacturing a schottky contact on a semiconductor substrateST MICROELECTRONICS SRL·Filed 2005·Application pending·0 cites
- 0831US11719832B2Silicon carbide ionizing radiation detectorISTITUTO NAZ FISICA NUCLEARE·Filed 2019·Granted Aug 8, 2023·0 cites·16 claims
- 0929US2014264385A1Manufacture of wafers of wide energy gap semiconductor material for the integration of electronic and/or optical and/or optoelectronic devicesMASSIMO CAMARDA·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →