Inventor

HSU CHIA-HSIANG

TW63 patents

⚠️ This page may combine multiple inventors who share the name “HSU CHIA-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU CHIA-HSIANG

CORETECH SYS CO LTD

Display screen with an animated graphical user interface

Display screen with a graphical user interface

Display screen with an animated graphical user interface

Method of measuring extensional viscosity of polymer melts and capillary injection system

Molding system for preparing fiber-reinforced thermoplastic composite article

Molding system for preparing an injection molded fiber reinforced composite article

Molding system for preparing an injection molded fiber reinforced composite article

Method for preparing a fiber-reinforced composite article by using computer-aided engineering

Computer-implemented simulation method and non-transitory computer medium capable of predicting fiber orientation for use in a molding process

Display screen with animated graphical user interface for a molding process

Molding system and method for operating the same

Method for operating a molding machine with a predicted in-mold PVT waveform of a molding resin

Computer-implemented simulation method and non-transitory computer medium for use in molding process

Molding system for preparing fiber-reinforced thermoplastic composite article

Molding system for preparing fiberless thermoplastic composite article

Molding system for preparing an injection molded fiber reinforced composite article

Molding system for preparing fiber-reinforced thermoplastic composite article

Molding system

Display screen or portion thereof with graphical user interface

Predicting shrinkage of injection molded products with viscoelastic characteristic

Method of mesh generation for resin transfer molding process

Method of measuring underfill profile of underfill cavity having solder bumps

Method of setting pressure profile of injection-molding apparatus

Method for setting molding conditions of injection-molding equipment

System for setting molding conditions of injection-molding equipment

Molding system for preparing injuection-molded article

Computer-implemented simulation method and non-transitory computer medium for use in molding process, and molding system using the same

Clamping mechanism assembly

Computer-implemented simulation method for injection-molding process

Computer-implemented composite simulation method and non-transitory computer medium for use in molding process

Method of measuring voids in underfill package

Method for measuring a flowing property in a resin transfer molding system

Molding system for preparing an injection-molded article

Molding system for preparing molded article with orientation effect

Molding system for preparing thermoplastic composite article

Molding system for preparing injection-molded article

Method for setting up a molding system

Molding system for preparing molding article

NANYA TECHNOLOGY CORP

Semiconductor device with interconnect part and method for forming the same

Semiconductor device with air gaps

Method for preparing a semiconductor device with interconnect part

Method for preparing semiconductor device structure with multiple liners

Semiconductor device structure with multiple liners and method for forming the same

Semiconductor device with landing pad of conductive polymer and method for fabricating the same

Method for preparing semiconductor device structure with patterns having different heights

MEDIATEK INC

Coordination of Wi-Fi P2P and LTE data traffic

Wireless communications devices supporting WiFi and LTE communications and methods for transmission control thereof

Wireless communications devices supporting WiFi and LTE communications and methods for transmission control thereof

TSENG HUAN CHANG

Method and computer readable media for determining orientation of fibers in a fluid

REALTEK SEMICONDUCTOR CORP

Signal transmitting device