Molding system

Abstract

A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

What is claimed is: 
     
       1. A molding system, comprising:
 a molding machine; 
 a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine; and 
 a computing means connected to the molding machine, wherein the computing means is configured to perform operations for setting the molding machine to prepare a molding product, the operations comprising: 
 generating first and second state waveforms using a setting packing pressure profile, wherein the first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin, and wherein a maximum in-mold pressure of the first state waveform is larger than that of the second state waveform; 
 obtaining an updated packing pressure profile having a first control node and a second control node after the first control node, wherein the first control node has a first packing time at which the first state waveform substantially reaches the maximum in-mold pressure, and wherein the first control node has a first packing pressure and the second control node has a second packing pressure smaller than the first packing pressure; and 
 setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. 
 
     
     
       2. The molding system of  claim 1 , wherein the setting packing pressure profile has an initial packing pressure, and the computing apparatus is configured to obtain the first packing pressure based on the initial packing pressure. 
     
     
       3. The molding system of  claim 1 , wherein the first state waveform includes an isobaric phase and an isochoric phase following the isobaric phase, and the second control node has a second packing time corresponding to a transition between the isobaric phase and the isochoric phase. 
     
     
       4. The molding system of  claim 1 , wherein the molding resin has a first specific volume at a predetermined ejection temperature and a normal pressure, and a second specific volume at the predetermined ejection temperature and a designed pressure; and the second control node has a second packing time between a starting time and an ending time, wherein the starting time corresponds to a time at which the molding resin is isobarically cooled at the maximum in-mold pressure to reach the first specific volume and the ending time corresponding to a time at which the molding resin is isobarically cooled at the maximum in-mold pressure to reach the second specific volume. 
     
     
       5. The molding system of  claim 1 , wherein the second control node has a second packing pressure, and the computing apparatus is configured to obtain the second packing pressure based on the first packing pressure. 
     
     
       6. The molding system of  claim 1 , wherein the first and the second state waveforms have a first and a second ejection pressures, respectively, and the step of obtaining an updated packing pressure profile comprises:
 calculating a first pressure deviation between the first ejection pressure and an expected ejection pressure, and a second pressure deviation between the second ejection pressure and the expected ejection pressure; and 
 adjusting the first packing pressure based on the first pressure deviation if the first pressure deviation is larger than the second pressure deviation. 
 
     
     
       7. The molding system of  claim 1 , wherein the updated packing pressure profile has a third control node after the second control node, wherein the third control node has a third packing time at which one of the first and the second state waveforms substantially reaches a maximum in-mold specific volume. 
     
     
       8. The molding system of  claim 7 , wherein
 the first state waveform includes an isobaric phase and an isochoric phase following the isobaric phase, and the second control node has a second packing time corresponding to a transition between the isobaric phase and the isochoric phase; and 
 the computing apparatus is configured to obtain a third packing pressure of the third control node based on a designed pressure and the maximum in-mold pressure, wherein the designed pressure is obtained based on the in-mold temperature at the third packing time and an in-mold specific volume at the second packing time. 
 
     
     
       9. The molding system of  claim 1 , wherein the updated packing pressure profile has a third control node after the second control node, wherein the third control node has a third packing time at which a pressure difference between the first and the second state waveforms reaches a maximum value, and wherein the computing apparatus is configured to obtain a third packing pressure of the third control node based on the pressure difference. 
     
     
       10. The molding system of  claim 1 , wherein the computing apparatus is configured to add a third control node in the updated packing pressure profile if the molding resin is transferred from the molding machine into the mold cavity after the first state waveform substantially reaches the maximum in-mold pressure. 
     
     
       11. The molding system of  claim 1 , wherein the computing apparatus is configured to change the updated packing pressure profile by multiplying the first packing pressure and the second packing pressure by a constant value for changing an ejection pressure of the molding product. 
     
     
       12. The molding system of  claim 1 , wherein the computing apparatus is configured to change the updated packing pressure profile by multiplying the first packing pressure by a constant value. 
     
     
       13. The molding system of  claim 1 , wherein the first state waveform includes an isobaric phase and an isochoric phase following the isobaric phase, and the computing apparatus is configured to change the updated packing pressure profile by changing the second packing time for changing the isobaric phase. 
     
     
       14. The molding system of  claim 1 , wherein the operation of generating the first and second state waveforms is performed by a virtual molding process. 
     
     
       15. The molding system of  claim 1 , wherein the operation of generating the first and second state waveforms is performed by a plurality of sensors disposed at different sensing sites of the mold. 
     
     
       16. A molding system, comprising:
 a molding machine; 
 a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine; and 
 a computing means connected to the molding machine, wherein the computing means is configured to perform operations for setting the molding machine to prepare a molding product, the operations comprising steps of: 
 generating first and second state waveforms using a setting packing pressure profile, wherein the first and the second state waveforms express a relationship between an in-mold specific volume and an in-mold temperature at different sensing sites of the molding resin; 
 obtaining an updated packing pressure profile having a first control node, a second control node after the first control node, and a third control node after the second control node; and 
 setting the molding machine based on the updated packing pressure profile to perform an actual molding to prepare the molding product; 
 wherein the first control node has a first packing time at which one of the first and the second state waveforms substantially reaches a maximum in-mold pressure; 
 wherein the first state waveform includes an isobaric phase and an isochoric phase following the isobaric phase, and the second control node has a second packing time corresponding to a transition between the isobaric phase and the isochoric phase; 
 wherein the third control node has a third packing time at which one of the first and the second state waveforms substantially reaches a maximum in-mold specific volume; and 
 wherein the computing apparatus is configured to obtain a third packing pressure of the third control node based on a designed pressure and the maximum in-mold pressure, and the designed pressure is obtained based on the in-mold temperature at the third packing time and the in-mold specific volume at the second packing time. 
 
     
     
       17. The molding system of  claim 16 , wherein the updated packing pressure profile has a fourth control node after the third control node, the fourth control node has a fourth packing time at which a pressure difference between first and second state waveforms reaches a maximum value, and the computing apparatus is configured to obtain a fourth packing pressure of the fourth control node based on the pressure difference. 
     
     
       18. The molding system of  claim 16 , wherein the operation of generating the first and second state waveforms is performed by a virtual molding process. 
     
     
       19. The molding system of  claim 16 , wherein the operation of generating the first and second state waveforms is performed by a plurality of sensors disposed at different sensing sites of the mold. 
     
     
       20. A molding system, comprising:
 a molding machine; 
 a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine; and 
 a computing means connected to the molding machine, wherein the computing means is configured to perform operations for setting the molding machine to prepare a molding product, the operations comprising steps of: 
 generating first and second state waveforms using a setting packing pressure profile, wherein the first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin; 
 obtaining an updated packing pressure profile having a control node, wherein the control node has a packing time at which a pressure difference between the first and the second state waveforms reaches a maximum value, and wherein the computing apparatus is configured to obtain a packing pressure of the control node based on the pressure difference; and 
 setting the molding machine based on the updated packing pressure profile to perform an actual molding to prepare the molding product.