Inventor · disambiguated record
Chuan-Wei Chang
Also filed as: CHANG CHUAN WEI
12 granted patents·164 citations·filing 2014–2020
90Inventor score
Files withCORETECH SYS CO LTD12
Top patents by PatentIndex Score
12 records- 0196USD817970SDisplay screen with an animated graphical user interfaceCORETECH SYS CO LTD·Filed 2016·Granted May 15, 2018·72 cites·1 claims
- 0293US10076862B1Molding systemCORETECH SYS CO LTD·Filed 2017·Granted Sep 18, 2018·5 cites·20 claims
- 0393US9555571B1Method for operating a molding machine with a predicted in-mold PVT waveform of a molding resinCORETECH SYS CO LTD·Filed 2015·Granted Jan 31, 2017·15 cites·22 claims
- 0491US9684295B2Molding system and method for operating the sameCORETECH SYS CO LTD·Filed 2016·Granted Jun 20, 2017·8 cites·10 claims
- 0587USD784392SDisplay screen with an animated graphical user interfaceCORETECH SYS CO LTD·Filed 2016·Granted Apr 18, 2017·30 cites·1 claims
- 0677USD866566SDisplay screen with a graphical user interfaceCORETECH SYS CO LTD·Filed 2017·Granted Nov 12, 2019·17 cites·1 claims
- 0773USD790582SDisplay screen with animated graphical user interface for a molding processCORETECH SYS CO LTD·Filed 2016·Granted Jun 27, 2017·15 cites·1 claims
- 0866US10384386B2Method for setting up a molding systemCORETECH SYS CO LTD·Filed 2018·Granted Aug 20, 2019·0 cites·20 claims
- 0965US8868389B2Computer-implemented simulation method and non-transitory computer medium for use in molding process, and molding system using the sameCORETECH SYS CO LTD·Filed 2014·Granted Oct 21, 2014·2 cites·14 claims
- 1064US11230043B2Method for setting molding conditions of injection-molding equipmentCORETECH SYS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·7 claims
- 1160US11225005B2System for setting molding conditions of injection-molding equipmentCORETECH SYS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·11 claims
- 1255US10562218B2Method for setting up a molding systemCORETECH SYS CO LTD·Filed 2018·Granted Feb 18, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →