Inventor

HIATT WILLIAM M

US101 patents

⚠️ This page may combine multiple inventors who share the name “HIATT WILLIAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIATT WILLIAM M

MICRON TECHNOLOGY INC

Semiconductor component having plate, stacked dice and conductive vias

Backside method for fabricating semiconductor components with conductive interconnects

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Semiconductor component having encapsulated, bonded, interconnect contacts

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Through-wafer interconnects for photoimager and memory wafers

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

Microelectronic devices and methods for forming interconnects in microelectronic devices

Pass through via technology for use during the manufacture of a semiconductor device

Multi-dice chip scale semiconductor components

Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts

Methods of fabricating substrates including one or more conductive vias

Microelectronic devices and methods for forming interconnects in microelectronic devices

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Semiconductor component having plate and stacked dice

Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices

Methods for fabricating semiconductor components with conductive interconnects having planar surfaces

Semiconductor components with conductive interconnects

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

Microelectronic devices and methods for forming interconnects in microelectronic devices

System for fabricating semiconductor components with conductive interconnects

Methods for fabricating semiconductor components with conductive interconnects

Multi-component integrated circuit contacts

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Multi-component integrated circuit contacts

Methods of fabricating substrates including at least one conductive via

Compliant contact pin assembly, card system and methods thereof

Selective nickel plating of aluminum, copper, and tungsten structures

Prefabricated housings for microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Multi-component integrated circuit contacts

Electrical contacts with dielectric cores

Methods of coating and singulating wafers

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

Methods for forming interconnects in vias and microelectronic workpieces including such interconnects

Microelectronic devices and methods for filling vias in microelectronic devices

Through-wafer interconnects for photoimager and memory wafers

Methods for thinning semiconductor substrates that employ support structures formed on the substrates

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Imager with tuned color filter

Through-hole conductors for semiconductor substrates and method for making same

Method for making through-hole conductors for semiconductor substrates

Microelectronic imagers and methods of packaging microelectronic imagers

HIATT WILLIAM M

Microelectronic devices and methods for filling vias in microelectronic devices

Multi-component integrated circuit contacts

JANZEN JEFFERY W

Disabling electrical connections using pass-through 3D interconnects and associated systems and methods

AKRAM SALMAN

Through-wafer interconnects for photoimager and memory wafers

ROUND ROCK RES LLC

Packaged microelectronic imagers and methods of packaging microelectronic imagers

APTINA IMAGING CORP

Packaged microelectronic imagers and methods of packaging microelectronic imagers