Inventor

UZOH CYPRIAN E

US58 patents

⚠️ This page may combine multiple inventors who share the name “UZOH CYPRIAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UZOH CYPRIAN E

IBM

Triple damascence tungsten-copper interconnect structure

Serial intelligent electro-chemical-mechanical wafer processor

Electroplating workpiece fixture having liquid gap spacer

Electroetch and chemical mechanical polishing equipment

Open-bottomed via liner structure and method for fabricating same

Continuous highly conductive metal wiring structures and method for fabricating the same

Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries

Method for plating copper conductors and devices formed

Method and apparatus for enhancing the uniformity of electrodeposition or electroetching

Process for forming a copper-containing film

Electromigration-resistant copper microstructure and process of making

Anode design for semiconductor deposition having novel electrical contact assembly

Graded composition diffusion barriers for chip wiring applications

Graded composition diffusion barriers for chip wiring applications

Copper wire-bonding pad

Copper film including laminated impurities

Electroplating electrical contacts

Enhancing copper electromigration resistance with indium and oxygen lamination

Method for enhancing the uniformity of electrodeposition or electroetching

Electromigration-resistant copper microstructure

Anode design for semiconductor deposition

Method to build multi level structure

Microstructure liner having improved adhesion

Method to produce high quality metal fill in deep submicron vias and lines

Method to test devices on high performance ULSI wafers

Method of improving contact reliability for electroplating

Open-bottomed via liner structure and method for fabricating same

NOVELLUS SYSTEMS INC

Method and system to provide electrical contacts for electrotreating processes

Low-force electrochemical mechanical processing method and apparatus

Method of forming contact layers on substrates

Method of forming contact layers on substrates

Apparatus for reduction of defects in wet processed layers

Method and system to provide electrical contacts for electrotreating processes

Electrode assembly for electrochemical processing of workpiece

Method of electroplating copper layers with flat topography

Method and system for optically enhanced metal planarization

ASM NUTOOL INC

Multi step electrodeposition process for reducing defects and minimizing film thickness

Planarity detection methods and apparatus for electrochemical mechanical processing systems

Method and system monitoring and controlling film thickness profile during plating and electroetching

Method for reduction of defects in wet processed layers

Method and structure to reduce defects in integrated circuits and substrates

Electroetching methods and systems using chemical and mechanical influence

Method for electrochemically processing a workpiece

Electrochemical mechanical processing with advancible sweeper

NUTOOL INC

Method for electrochemically processing a workpiece

Method and system to provide electroplanarization of a workpiece with a conducting material layer

Carrier head for holding a wafer and allowing processing on a front face thereof to occur

Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs

Method and system to provide material removal and planarization employing a reactive pad

Edge and bevel cleaning process and system