Inventor

LEE JONG-MYEONG

KR60 patents

⚠️ This page may combine multiple inventors who share the name “LEE JONG-MYEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JONG-MYEONG

SAMSUNG ELECTRONICS CO LTD

Method for forming metal interconnection in semiconductor device and interconnection structure fabricated thereby

Methods of producing integrated circuit devices utilizing tantalum amine derivatives

Method of fabricating metal lines in a semiconductor device

Method of selectively depositing a metal layer in an opening in a dielectric layer by forming a metal-deposition-prevention layer around the opening of the dielectric layer

Wafer processing apparatus and wafer processing method using the same

Wafer processing apparatus and wafer processing method using the same

Methods of forming interlayer dielectrics having air gaps

Methods of producing integrated circuit devices utilizing tantalum amine derivatives

Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same

Methods for forming metal interconnections for semiconductor devices having multiple metal depositions

Methods for forming metal wiring layers and metal interconnects and metal interconnects formed thereby

Oxide film, integrated circuit device, and methods of forming the same

Methods of forming metal wiring in semiconductor devices using etch stop layers

Methods of forming a conductive structure in an integrated circuit device

Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers

MIM capacitors with diffusion-blocking electrode structures and semiconductor devices including the same

Method for forming a wiring of a semiconductor device, method for forming a metal layer of a semiconductor device and apparatus for performing the same

Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer

Methods for forming aluminum metal wirings

Method of forming a contact in a semiconductor device

Metal film semiconductor device and a method for forming the same

Methods of fabricating semiconductor devices using nanowires

Method of manufacturing a metal wiring structure

Methods of forming a semiconductor device including a diffusion barrier film

Semiconductor device and methods of forming the same

Methods of removing resistive remnants from contact holes using silicidation

Semiconductor device fabrication method for filling high aspect ratio openings in insulators with aluminum

Heating chamber and method of heating a wafer

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Integrated circuit devices with crack-resistant fuse structures

Semiconductor device including fuse

Method of manufacturing a semiconductor device

Methods of forming metal layers in the fabrication of semiconductor devices

Semiconductor devices and methods of manufacturing the same

PARK JIN-HO

Method of manufacturing a semiconductor device

Methods of manufacturing semiconductor devices

Semiconductor devices and methods of manufacturing the same

CHOI KYUNG-IN

Method of manufacturing a metal wiring structure

Methods of forming metal interconnection structures

KANG PIL-KYU

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process

KIM SU-KYOUNG

Non-volatile memory device

HONG JONG-WON

Semiconductor devices and methods of manufacturing the same

BAEK JONG-MIN

Method of fabricating semiconductor device

KIM HEI-SEUNG

Semiconductor device conductive pattern structures including dummy conductive patterns

LIM DONG-CHAN

Via structures and semiconductor devices having the via structures

KOREA RES INST CHEMICAL TECH

Composite membrane comprising highly permeable gutter layer and method for preparing same

LEE JONG-MYEONG

Structures electrically connecting aluminum and copper interconnections and methods of forming the same

LEE WOO-JIN

Method of forming a dielectric layer having an ONO structure using an in-situ process

AHN SANG-HOON

Methods of forming integrated circuit devices with crack-resistant fuse structures