Inventor
MAO KUAN-HSIANG
US9 patents
Patents
9 patentsUS12288770B2Apr 29, 2025
Semiconductor packages with embedded wiring on re-distributed bumps
NXP BV2 citations69
US11640947B2May 2, 2023
Pre-resist island forming via method and apparatus
NXP BV2 citations68
US12406951B2Sep 2, 2025
Redistribution layer having a sideview zig-zag profile
NXP BV0 citations59
US12198998B2Jan 14, 2025
Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process
NXP BV0 citations58
US11935753B2Mar 19, 2024
Backside and sidewall metallization of semiconductor devices
NXP BV0 citations58
US12588538B2Mar 24, 2026
Semiconductor device having wired under bump structure and method therefor
NXP BV0 citations56
US12387985B2Aug 12, 2025
Semiconductor device with cavity carrier and method therefor
NXP BV0 citations54
US12080601B2Sep 3, 2024
Packaged semiconductor devices and methods therefor
NXP BV0 citations49
US12494448B2Dec 9, 2025
UBM-free metal skeleton frame with support studs and method for fabrication thereof
NXP BV0 citations47