Inventor

THACKER HIREN D

US26 patents

⚠️ This page may combine multiple inventors who share the name “THACKER HIREN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

THACKER HIREN D

ORACLE INT CORP

Hybrid-integrated photonic chip package

Packaged opto-electronic module

Hybrid-integrated photonic chip package with an interposer

Hybrid-integrated photonic chip package with an interposer

Integrated electro-absorption modulator

Waveguide-last silicon photonic optical connector assembly

Hybrid integrated photonic chip package

Integrated electro-absorption modulator

Method for singulating hybrid integrated photonic chips

Stackable photonic interconnect module

Reflow-compatible optical I/O assembly adapter

Extracting an embedded DC signal to provide a reference voltage for an optical receiver

Chip package for high-count chip stacks

Electroplated solder for high-temperature interconnect

Multi-chip module with self-populating positive features

THACKER HIREN D

Maintaining alignment in a multi-chip module using a compressible structure

Direct interlayer optical coupler

Interconnection and assembly of three-dimensional chip packages

Batch process for three-dimensional integration

Assembly of multi-chip modules with proximity connectors using reflowable features

Optical device with enhanced mechanical strength

SHI JING

Mechanical coupling in a multi-chip module using magnetic components

Mechanical coupling in a multi-chip module using magnetic components

Self-locking features in a multi-chip module

RAJ KANNAN

Efficient inter-chip optical coupling

GEORGIA TECH RES INST

Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication