Reflow-compatible optical I/O assembly adapter

Abstract

The disclosed embodiments provide an apparatus for connecting one or more optical fibers to an optoelectronic system. This apparatus includes a packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate. The apparatus also includes an assembly adapter enclosing the POeM, wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule enclosing at least one optical fiber during assembly of the apparatus. The assembly adapter is comprised of a solder-reflow-compatible material to facilitate bonding the assembly adapter to a circuit board.

What is claimed is: 
     
       1. An apparatus that connects one or more optical fibers to an optoelectronic system, comprising:
 a wafer-level packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate; and 
 an assembly adapter enclosing the POeM; 
 wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule enclosing at least one optical fiber during assembly of the apparatus; 
 wherein the assembly adapter is comprised of a solder-reflow-compatible material to facilitate bonding the assembly adapter to a circuit board; and 
 a clamp that secures the MT ferrule in the MT ferrule cavity, wherein the clamp is applied between the MT ferrule and assembly adapter such that clamping force will be mainly applied between the MT ferrule, the assembly adapter and a protruding part of the optical connector, wherein the clamp mechanically protects the optical connector and the SiP chip. 
 
     
     
       2. The apparatus of  claim 1 , wherein the assembly adapter includes one or more clamp registration structures to facilitate attachment of the clamp. 
     
     
       3. The apparatus of  claim 1 , further comprising a plug to protect an exposed surface of the optical connector after assembly of the apparatus. 
     
     
       4. The apparatus of  claim 1 , further comprising a sealing window filled with a sealing material to protect an exposed surface of the optical connector after assembly of the apparatus. 
     
     
       5. The apparatus of  claim 1 , further comprising a dust cap having the same dimensions as the MT ferrule, wherein the dust cap is used to fill the MT ferrule cavity when no MT ferrule is inserted. 
     
     
       6. The apparatus of  claim 1 , wherein the assembly adapter is comprised of metal, whereby the assembly adapter functions as a heat sink. 
     
     
       7. The apparatus of  claim 1 , wherein the assembly adapter is comprised of a liquid-crystal polymer (LCP) to facilitate high-volume, low-cost production. 
     
     
       8. The apparatus of  claim 1 , wherein the optical connector is edge-coupled with the SiP chip in the POeM. 
     
     
       9. The apparatus of  claim 1 , wherein the optical connector is face-coupled with the SiP chip in the POeM. 
     
     
       10. The apparatus of  claim 1 , wherein the optical connector is butt-coupled with the MT ferrule after insertion of the MT ferrule. 
     
     
       11. The apparatus of  claim 1 , wherein the assembly adapter includes a heat-sink-access opening to facilitate attaching a heat sink to one or more components in the POeM. 
     
     
       12. The apparatus of  claim 1 , wherein the assembly adapter includes an embedded heat spreader to facilitate dissipating heat generated by one or more components in the POeM. 
     
     
       13. The apparatus of  claim 1 , further comprising the circuit board, wherein the assembly adapter is soldered to the circuit board. 
     
     
       14. The apparatus of  claim 1 , wherein components of the POeM are housed in cavities formed in the assembly adapter. 
     
     
       15. The apparatus of  claim 14 , wherein the cavities formed in the assembly adapter include a connector cavity with a connector registration structure. 
     
     
       16. A system, comprising:
 at least one processor; and 
 at least one memory coupled to the at least one processor; 
 wherein the system includes optoelectronic components, including an optoelectronic connector, comprising:
 a wafer-level packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate; and 
 an assembly adapter enclosing the POeM; 
 wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule enclosing at least one optical fiber during assembly of the apparatus; 
 wherein the assembly adapter is comprised of a solder-reflow-compatible material to facilitate bonding the assembly adapter to a circuit board; and 
 a clamp that secures the MT ferrule in the MT ferrule cavity, wherein the clamp is applied between the MT ferrule and assembly adapter such that clamping force will be mainly applied between the MT ferrule, the assembly adapter and a protruding part of the optical connector, wherein the clamp mechanically protects the optical connector and the SiP chip. 
 
 
     
     
       17. A method for assembling an optical-connector assembly that connects one or more optical fibers to an optoelectronic system, comprising:
 forming a wafer-level packaged optoelectronic module (POeM) comprising an optical connector, a silicon photonic (SiP) chip, an integrated circuit (IC) chip, at least one laser chip and a package substrate; 
 face-down aligning and bonding an optical connector to a SiP chip to form a connector/SiP coupling; 
 face-down bonding an assembly adapter to the optical connector, wherein the assembly adapter includes a mechanical transfer (MT) ferrule cavity, which includes one or more coarse-alignment structures to guide an MT ferrule containing at least one optical fiber, during insertion of the MT ferrule into the MT ferrule cavity;
 inserting a dust cap into the MT ferrule cavity, wherein the dust cap has the same dimensions as the MT ferrule; 
 using a clamp to clamp together components of the optical-connector assembly; and 
 performing a solder-reflow operation to solder the assembly adapter to a circuit board; and 
 
 wherein the clamp secures the MT ferrule in the MT ferrule cavity, wherein the clamp is applied between the MT ferrule and assembly adapter such that clamping force is mainly applied between the MT ferrule, the assembly adapter and a protruding part of the optical connector, wherein the clamp mechanically protects the optical connector and the SiP chip. 
 
     
     
       18. The method of  claim 17 , wherein the solder-reflow operation takes place at one of the following times:
 after forming the connector/SiP coupling, but before the assembly adapter is face-down bonded to the optical connector; and
 after clamping together the components of the optical-connector assembly. 
 
 
     
     
       19. The method of  claim 18 , further comprising connecting the MT ferrule to the optical-connector assembly by:
 removing the clamp from the optical-connector assembly; 
 removing the dust cap from the MT ferrule cavity; 
 inserting the MT ferrule into the MT ferrule cavity; and 
 using the clamp to clamp together the components of the optical-connector assembly.