Inventor · disambiguated record
Ivan Shubin
Also filed as: SHUBIN IVAN
35 granted patents·1 pending application·472 citations·filing 2009–2018
97Inventor score
Top patents by PatentIndex Score
36 records- 0198US9698564B1Hybrid integrated MCM with waveguide-fiber connectorORACLE INT CORP·Filed 2016·Granted Jul 4, 2017·43 cites·18 claims
- 0298US9470855B1Self-assembled vertically aligned multi-chip moduleORACLE INT CORP·Filed 2015·Granted Oct 18, 2016·17 cites·19 claims
- 0397US9829626B2Hybrid-integrated multi-chip moduleORACLE INT CORP·Filed 2016·Granted Nov 28, 2017·24 cites·20 claims
- 0497US9297971B2Hybrid-integrated photonic chip package with an interposerORACLE INT CORP·Filed 2013·Granted Mar 29, 2016·46 cites·20 claims
- 0596US9250403B2Hybrid-integrated photonic chip package with an interposerORACLE INT CORP·Filed 2013·Granted Feb 2, 2016·28 cites·20 claims
- 0696US9142698B1Integrated electro-absorption modulatorORACLE INT CORP·Filed 2014·Granted Sep 22, 2015·28 cites·19 claims
- 0796US8548287B2Direct interlayer optical couplerTHACKER HIREN D·Filed 2011·Granted Oct 1, 2013·37 cites·20 claims
- 0894US9411177B2Integrated electro-absorption modulatorORACLE INT CORP·Filed 2015·Granted Aug 9, 2016·11 cites·8 claims
- 0994US8742576B2Maintaining alignment in a multi-chip module using a compressible structureTHACKER HIREN D·Filed 2012·Granted Jun 3, 2014·64 cites·20 claims
- 1092US9696486B2Surface-normal coupler for silicon-on-insulator platformsORACLE INT CORP·Filed 2013·Granted Jul 4, 2017·14 cites·11 claims
- 1192US8218334B2Multi-chip module with multi-level interposerCHOW EUGENE M·Filed 2010·Granted Jul 10, 2012·13 cites·18 claims
- 1290US8982563B2Chip package to support high-frequency processorsRAJ KANNAN·Filed 2011·Granted Mar 17, 2015·13 cites·18 claims
- 1390US8014636B2Electrical contacts on top of waveguide structures for efficient optical modulation in silicon photonic devicesOracle America·Filed 2009·Granted Sep 6, 2011·20 cites·26 claims
- 1489US8772920B2Interconnection and assembly of three-dimensional chip packagesTHACKER HIREN D·Filed 2011·Granted Jul 8, 2014·11 cites·20 claims
- 1589US8390109B2Chip package with plank stack of semiconductor diesPOPOVIC DARKO R·Filed 2011·Granted Mar 5, 2013·22 cites·20 claims
- 1688US9871346B1Mode-hop-free hybrid external-cavity laser with passive thermo-optic coefficient compensationORACLE INT CORP·Filed 2017·Granted Jan 16, 2018·4 cites·20 claims
- 1788US7848599B2Optical device with large thermal impedanceORACLE AMERICA INC·Filed 2009·Granted Dec 7, 2010·14 cites·19 claims
- 1887US8988770B2Hybrid optical source with semiconductor reflectorORACLE INT CORP·Filed 2013·Granted Mar 24, 2015·7 cites·20 claims
- 1987US8428404B1Optical device on inverted, substrateless chipSHUBIN IVAN·Filed 2011·Granted Apr 23, 2013·10 cites·20 claims
- 2084US8131119B2Optical device with large thermal impedanceCUNNINGHAM JOHN E·Filed 2010·Granted Mar 6, 2012·7 cites·20 claims
- 2182US9519105B1Self-assembled vertically aligned multi-chip moduleORACLE INT CORP·Filed 2016·Granted Dec 13, 2016·3 cites·17 claims
- 2280US10591689B2Reflow-compatible optical I/O assembly adapterORACLE INT CORP·Filed 2017·Granted Mar 17, 2020·3 cites·19 claims
- 2379US9488777B2Back-side etching and cleaving of substratesORACLE INT CORP·Filed 2013·Granted Nov 8, 2016·3 cites·18 claims
- 2479US8078013B2Dual-layer thermally tuned optical deviceLI GUOLIANG·Filed 2009·Granted Dec 13, 2011·8 cites·20 claims
- 2577US8796811B2Hybrid substrateless device with enhanced tuning efficiencySHUBIN IVAN·Filed 2011·Granted Aug 5, 2014·4 cites·16 claims
- 2676US8150223B2Thermal tuning of an optical deviceLI GUOLIANG·Filed 2009·Granted Apr 3, 2012·7 cites·17 claims
- 2774US9575251B1Optical mode converter having multiple regionsORACLE INT CORP·Filed 2015·Granted Feb 21, 2017·2 cites·20 claims
- 2873US9465169B2Single shot correction of resonant optical componentsORACLE INT CORP·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 2970US9281268B2Method for fabricating multi-chip module with multi-level interposerCHOW EUGENE M·Filed 2012·Granted Mar 8, 2016·2 cites·9 claims
- 3069US9618709B2Hybrid integration of edge-coupled chipsORACLE INT CORP·Filed 2013·Granted Apr 11, 2017·2 cites·19 claims
- 3169US8600201B2Optical device with enhanced mechanical strengthTHACKER HIREN D·Filed 2011·Granted Dec 3, 2013·2 cites·20 claims
- 3267US8971674B2Optical device with high thermal tuning efficiencySHUBIN IVAN·Filed 2010·Granted Mar 3, 2015·1 cites·18 claims
- 3360US9164231B2Ultra-compact photodetector on an optical waveguideSHUBIN IVAN·Filed 2011·Granted Oct 20, 2015·1 cites·17 claims
- 3453US10514502B2Back-side etching and cleaving of substratesORACLE INT CORP·Filed 2016·Granted Dec 24, 2019·0 cites·9 claims
- 3543US9812842B2Hybrid optical source with optical proximity coupling provided by an external reflectorORACLE INT CORP·Filed 2016·Granted Nov 7, 2017·0 cites·20 claims
- 3643US2019187373A1Hybrid fiber integrated soi/iii-v moduleROSHMERE INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →