Inventor · disambiguated record
Hiren D. Thacker
Also filed as: THACKER HIREN · THACKER HIREN D
28 granted patents·9 pending applications·511 citations·filing 2003–2024
97Inventor score
Top patents by PatentIndex Score
37 records- 0198US8971676B1Hybrid-integrated photonic chip packageORACLE INT CORP·Filed 2013·Granted Mar 3, 2015·74 cites·19 claims
- 0297US9678271B2Packaged opto-electronic moduleORACLE INT CORP·Filed 2015·Granted Jun 13, 2017·23 cites·20 claims
- 0397US9297971B2Hybrid-integrated photonic chip package with an interposerORACLE INT CORP·Filed 2013·Granted Mar 29, 2016·46 cites·20 claims
- 0496US9933574B1Waveguide-last silicon photonic optical connector assemblyORACLE INT CORP·Filed 2016·Granted Apr 3, 2018·21 cites·10 claims
- 0596US9256026B2Hybrid integrated photonic chip packageORACLE INT CORP·Filed 2014·Granted Feb 9, 2016·23 cites·20 claims
- 0696US9250403B2Hybrid-integrated photonic chip package with an interposerORACLE INT CORP·Filed 2013·Granted Feb 2, 2016·28 cites·20 claims
- 0796US9142698B1Integrated electro-absorption modulatorORACLE INT CORP·Filed 2014·Granted Sep 22, 2015·28 cites·19 claims
- 0896US8548287B2Direct interlayer optical couplerTHACKER HIREN D·Filed 2011·Granted Oct 1, 2013·37 cites·20 claims
- 0994US9411177B2Integrated electro-absorption modulatorORACLE INT CORP·Filed 2015·Granted Aug 9, 2016·11 cites·8 claims
- 1094US8742576B2Maintaining alignment in a multi-chip module using a compressible structureTHACKER HIREN D·Filed 2012·Granted Jun 3, 2014·64 cites·20 claims
- 1193US7348786B2Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabricationGEORGIA TECH RES INST·Filed 2005·Granted Mar 25, 2008·32 cites·26 claims
- 1292US9217836B2Edge coupling of optical devicesASGHARI MEHDI·Filed 2012·Granted Dec 22, 2015·19 cites·20 claims
- 1392US9159861B2Method for singulating hybrid integrated photonic chipsORACLE INT CORP·Filed 2013·Granted Oct 13, 2015·16 cites·18 claims
- 1492US8548288B2Efficient inter-chip optical couplingRAJ KANNAN·Filed 2011·Granted Oct 1, 2013·20 cites·20 claims
- 1591US8188581B2Mechanical coupling in a multi-chip module using magnetic componentsSHI JING·Filed 2009·Granted May 29, 2012·19 cites·18 claims
- 1689US8772920B2Interconnection and assembly of three-dimensional chip packagesTHACKER HIREN D·Filed 2011·Granted Jul 8, 2014·11 cites·20 claims
- 1786US8998509B2Stackable photonic interconnect moduleORACLE INT CORP·Filed 2013·Granted Apr 7, 2015·8 cites·20 claims
- 1885US9819421B1Extracting an embedded DC signal to provide a reference voltage for an optical receiverORACLE INT CORP·Filed 2016·Granted Nov 14, 2017·6 cites·20 claims
- 1981US9082808B2Batch process for three-dimensional integrationTHACKER HIREN D·Filed 2012·Granted Jul 14, 2015·6 cites·8 claims
- 2080US10591689B2Reflow-compatible optical I/O assembly adapterORACLE INT CORP·Filed 2017·Granted Mar 17, 2020·3 cites·19 claims
- 2173US8975754B2Chip package for high-count chip stacksORACLE INT CORP·Filed 2013·Granted Mar 10, 2015·3 cites·20 claims
- 2270US8648463B2Assembly of multi-chip modules with proximity connectors using reflowable featuresTHACKER HIREN D·Filed 2010·Granted Feb 11, 2014·3 cites·13 claims
- 2369US8600201B2Optical device with enhanced mechanical strengthTHACKER HIREN D·Filed 2011·Granted Dec 3, 2013·2 cites·20 claims
- 2469US8334149B2Mechanical coupling in a multi-chip module using magnetic componentsSHI JING·Filed 2012·Granted Dec 18, 2012·2 cites·17 claims
- 2563US9136237B2Electroplated solder for high-temperature interconnectORACLE INT CORP·Filed 2013·Granted Sep 15, 2015·1 cites·20 claims
- 2662US2025343214A1Hybrid silicon photonics-on-glass substrateCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2761US2025341686A1Tsv-enabled hybrid silicon photonics-on-glass packageCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2860US8896112B2Multi-chip module with self-populating positive featuresORACLE INT CORP·Filed 2013·Granted Nov 25, 2014·1 cites·14 claims
- 2951US2022384672A1High speed and high timing resolution cycling excitation process (cep) sensor array for nir lidarNANOVISION BIOSCIENCES INC·Filed 2022·Application pending·0 cites
- 3050US7554347B2High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of useGEORGIA TECH RES INST·Filed 2003·Granted Jun 30, 2009·4 cites·28 claims
- 3149US8315065B2Self-locking features in a multi-chip moduleSHI JING·Filed 2009·Granted Nov 20, 2012·0 cites·17 claims
- 3244US2015318254A1Electroplated solder with eutectic chemical compositionORACLE INT CORP·Filed 2013·Application pending·0 cites
- 3343US2022387786A1High visual acuity, high sensitivity light switchable neural stimulator array for implantable retinal prosthesisNANOVISION BIOSCIENCES INC·Filed 2022·Application pending·0 cites
- 3442US2014225284A1Low-cost chip package for chip stacksORACLE INT CORP·Filed 2013·Application pending·0 cites
- 3540US2023046820A1Apparatuses and methods for wirelessly powered charge-balanced electrical stimulationNANOVISION BIOSCIENCES INC·Filed 2021·Application pending·0 cites
- 3638US2018180808A1Wafer-level packaged optoelectronic moduleORACLE INT CORP·Filed 2016·Application pending·0 cites
- 3737US2005257709A1Systems and methods for three-dimensional lithography and nano-indentationMULE TONY·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →