Inventor
MAMODIA MOHIT
US15 patents
⚠️ This page may combine multiple inventors who share the name “MAMODIA MOHIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS10957656B2Mar 23, 2021
Integrated circuit packages with patterned protective material
INTEL CORP2 citations66
US10998275B2May 4, 2021
Package with cathodic protection for corrosion mitigation
INTEL CORP0 citations60
US11340258B2May 24, 2022
Probe pins with etched tips for electrical die test
INTEL CORP0 citations59
US9165914B2Oct 20, 2015
Forming die backside coating structures with coreless packages
INTEL CORP0 citations51
US10499461B2Dec 3, 2019
Thermal head with a thermal barrier for integrated circuit die processing
INTEL CORP0 citations50
US9793151B2Oct 17, 2017
Stiffener tape for electronic assembly
INTEL CORP0 citations50
US10598696B2Mar 24, 2020
Probe pins with etched tips for electrical die test
INTEL CORP0 citations49
US9406618B2Aug 2, 2016
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
INTEL CORP0 citations46
US9698108B1Jul 4, 2017
Structures to mitigate contamination on a back side of a semiconductor substrate
INTEL CORP0 citations36
XU DINGYING
2 patentsUS8287996B2Oct 16, 2012
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
XU DINGYING5 citations71
US8569108B2Oct 29, 2013
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
XU DINGYING0 citations50