P
US8304065B2ActiveUtilityPatentIndex 44

Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same

Assignee: ARANA LEONELPriority: Dec 28, 2009Filed: Dec 28, 2009Granted: Nov 6, 2012
Est. expiryDec 28, 2029(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:ARANA LEONELXU DINGYINGWAKHARKAR VIJAYFENG WENCHAKRAPANI NIRUPAMAGANAPATHYSUBRAMANIAN SHANKARSANCHEZ JORGEMAMODIA MOHIT
H10W 72/07236H10W 72/07202H10W 72/20H10W 72/07251H10W 72/252H10P 72/7438H10P 72/7416H10W 74/144H10P 72/7402Y10T428/2852Y10T428/2419Y10T428/25Y10T428/2495Y10T428/24942Y10T428/2839Y10T428/24124Y10T428/31703
44
PatentIndex Score
0
Cited by
2
References
11
Claims

Abstract

A treatment for a microelectronic device comprises a dicing tape ( 110 ) and a polymer composite film ( 120 ) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.

Claims

exact text as granted — not AI-modified
1. A treatment for a microelectronic device, the treatment comprising:
 a dicing tape; and 
 a polymer composite film comprising a colorant and further comprising a first layer that is tacky below a temperature of 50° C. and a second layer that is non-tacky below the temperature of 50° C. 
 
     
     
       2. The treatment of  claim 1  wherein:
 the polymer composite film has a pre-cure glass transition temperature that is greater than 50° Celsius. 
 
     
     
       3. The treatment of  claim 1  further comprising:
 a release liner between the dicing tape and the polymer composite film. 
 
     
     
       4. The treatment of  claim 1  wherein:
 the polymer composite film contains filler particles. 
 
     
     
       5. The treatment of  claim 4  wherein:
 the filler particles are no greater than 100 micrometers in size. 
 
     
     
       6. The treatment of  claim 5  wherein:
 the filler particles are no greater than 1 micrometer in size. 
 
     
     
       7. A treatment for a microelectronic device, the treatment comprising:
 a dicing tape having an adhesive layer thereon; and 
 a polymer composite film comprising: 
 a first layer having a first thickness and a first glass transition temperature; and 
 a second layer having a second thickness and a second glass transition temperature, wherein:
 the first glass transition temperature is less than 80° Celsius and the second glass transition temperature is greater than 50° Celsius. 
 
 
     
     
       8. The treatment of  claim 7  wherein:
 the first layer has a first filler content and the second layer has a second filler content that is greater than the first filler content. 
 
     
     
       9. The treatment of  claim 7  wherein:
 the first thickness is equal to the second thickness. 
 
     
     
       10. The treatment of  claim 7  wherein:
 the first thickness is greater than the second thickness. 
 
     
     
       11. The treatment of  claim 7  wherein:
 the first thickness is less than the second thickness.

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