US8304065B2ActiveUtilityPatentIndex 44
Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same
Est. expiryDec 28, 2029(~3.5 yrs left)· nominal 20-yr term from priority
Inventors:ARANA LEONELXU DINGYINGWAKHARKAR VIJAYFENG WENCHAKRAPANI NIRUPAMAGANAPATHYSUBRAMANIAN SHANKARSANCHEZ JORGEMAMODIA MOHIT
H10W 72/07236H10W 72/07202H10W 72/20H10W 72/07251H10W 72/252H10P 72/7438H10P 72/7416H10W 74/144H10P 72/7402Y10T428/2852Y10T428/2419Y10T428/25Y10T428/2495Y10T428/24942Y10T428/2839Y10T428/24124Y10T428/31703
44
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11
Claims
Abstract
A treatment for a microelectronic device comprises a dicing tape ( 110 ) and a polymer composite film ( 120 ) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
Claims
exact text as granted — not AI-modified1. A treatment for a microelectronic device, the treatment comprising:
a dicing tape; and
a polymer composite film comprising a colorant and further comprising a first layer that is tacky below a temperature of 50° C. and a second layer that is non-tacky below the temperature of 50° C.
2. The treatment of claim 1 wherein:
the polymer composite film has a pre-cure glass transition temperature that is greater than 50° Celsius.
3. The treatment of claim 1 further comprising:
a release liner between the dicing tape and the polymer composite film.
4. The treatment of claim 1 wherein:
the polymer composite film contains filler particles.
5. The treatment of claim 4 wherein:
the filler particles are no greater than 100 micrometers in size.
6. The treatment of claim 5 wherein:
the filler particles are no greater than 1 micrometer in size.
7. A treatment for a microelectronic device, the treatment comprising:
a dicing tape having an adhesive layer thereon; and
a polymer composite film comprising:
a first layer having a first thickness and a first glass transition temperature; and
a second layer having a second thickness and a second glass transition temperature, wherein:
the first glass transition temperature is less than 80° Celsius and the second glass transition temperature is greater than 50° Celsius.
8. The treatment of claim 7 wherein:
the first layer has a first filler content and the second layer has a second filler content that is greater than the first filler content.
9. The treatment of claim 7 wherein:
the first thickness is equal to the second thickness.
10. The treatment of claim 7 wherein:
the first thickness is greater than the second thickness.
11. The treatment of claim 7 wherein:
the first thickness is less than the second thickness.Cited by (0)
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