Inventor
ARANA LEONEL
US22 patents
⚠️ This page may combine multiple inventors who share the name “ARANA LEONEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
18 patentsUS7666768B2Feb 23, 2010
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
INTEL CORP23 citations92
US7528006B2May 5, 2009
Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
INTEL CORP17 citations83
US7892883B2Feb 22, 2011
Clipless integrated heat spreader process and materials
INTEL CORP9 citations79
US8383459B2Feb 26, 2013
Methods of processing a thermal interface material
INTEL CORP10 citations77
US7971347B2Jul 5, 2011
Method of interconnecting workpieces
INTEL CORP7 citations77
US11088103B2Aug 10, 2021
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP3 citations72
US12456705B2Oct 28, 2025
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP0 citations62
US12354992B2Jul 8, 2025
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP0 citations62
US11948848B2Apr 2, 2024
Subtractive etch resolution implementing a functional thin metal resist
INTEL CORP0 citations62
US11817349B2Nov 14, 2023
Conductive route patterning for electronic substrates
INTEL CORP0 citations61
US12341117B2Jun 24, 2025
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates
INTEL CORP0 citations60
US11506982B2Nov 22, 2022
Prism-mask for angled patterning applications
INTEL CORP0 citations58
US12334422B2Jun 17, 2025
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates
INTEL CORP0 citations55
US12027466B2Jul 2, 2024
Conductive route patterning for electronic substrates
INTEL CORP0 citations51
US12449600B2Oct 21, 2025
Position controlled waveguides and methods of manufacturing the same
INTEL CORP0 citations50
US10515824B2Dec 24, 2019
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field
INTEL CORP0 citations50
US12255130B2Mar 18, 2025
Airgap structures for high speed signal integrity
INTEL CORP0 citations48
US12033930B2Jul 9, 2024
Selectively roughened copper architectures for low insertion loss conductive features
INTEL CORP0 citations47