Inventor

SUTHIWONGSUNTHORN NATHAPONG

SG37 patents

⚠️ This page may combine multiple inventors who share the name “SUTHIWONGSUNTHORN NATHAPONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUTHIWONGSUNTHORN NATHAPONG

STATS CHIPPAC LTD

Semiconductor device and method of forming conductive TSV with insulating annular ring

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Method and apparatus for wafer level integration using tapered vias

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Wafer integrated with permanent carrier and method therefor

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support

Semiconductor device and method of forming conductive TSV with insulating annular ring

UTAC HEADQUARTERS PTE LTD

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods for forming semiconductor package

Methods for singulating semiconductor wafer

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Methods for singulating semiconductor wafer

MARIMUTHU PANDI CHELVAM

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support

SUTHIWONGSUNTHORN NATHAPONG

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

PAGAILA REZA A

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

NG CATHERINE BEE LIANG

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

UNITED TEST AND ASSEMBLY CENTER LTD

Semiconductor packages and methods for forming semiconductor package

Leadframe area array packaging technology

WANG CHUEN KHIANG

Semiconductor packages and methods of packaging semiconductor devices

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming a thin wafer without a carrier

UNITED TEST & ASSEMBLY CT LT

Semiconductor packages and methods of packaging semiconductor devices

MARIMUTHU PANDI C

Semiconductor device and method of forming a thin wafer without a carrier

HAN BYUNG JOON

Wafer integrated with permanent carrier and method therefor

DIMAANO JR ANTONIO BAMBALAN

Leadframe area array packaging technology