Inventor

DU YANG

US69 patents

⚠️ This page may combine multiple inventors who share the name “DU YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DU YANG

QUALCOMM INC

Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)

Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)

Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems

Monolithic three dimensional integration of semiconductor integrated circuits

Bondable device including a hydrophilic layer

Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods

Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methods

Data transfer across power domains

Semiconductor device and methods of making semiconductor device using graphene

Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods

Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)

Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs)

Clock distribution network for 3D integrated circuit

Dual power swing pipeline design with separation of combinational and sequential logics

Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methods

Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology

Spin transistors employing a piezoelectric layer and related memory, memory systems, and methods

Monolithic three dimensional (3D) flip-flops with minimal clock skew and related systems and methods

Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods

Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs)

Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems

Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace

3D floorplanning using 2D and 3D blocks

Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

Ultra-low power neuromorphic artificial intelligence computing accelerator

Ultra-low power neuromorphic artificial intelligence computing accelerator

Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cross-tier clock skew management systems, methods and related components

Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods

Method and apparatus for estimating resistance and capacitance of metal interconnects

Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits

Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

FREESCALE SEMICONDUCTOR INC

Integrated vertical stack capacitor

Asymmetric spacers and asymmetric source/drain extension layers

Method and circuit for multiplying signals with a transistor having more than one independent gate structure

Method and apparatus for forming an SOI body-contacted transistor

Semiconductor optical devices and method for forming

Semiconductor optical devices having fin structures

Semiconductor optical devices and method for forming

CASSIDY TIMOTHY M

Television monitor combination stand and wall mount

Television monitor combination stand and wall mount

YUNGU GUAN TECH CO LTD

Display screens and display devices

Methods of manufacturing display panels and display panels

UNIV ILLINOIS

Compositions and methods for carbon dioxide capture

Compositions and methods for carbon dioxide capture

MOTOROLA INC

High frequency signal isolation in a semiconductor device

UNIV BEIHANG

Fluorescence moleculartomography reconstruction method based on prior guidance of magnetic particle imaging

UNIV TEXAS

Blends of amines with piperazine for CO2 capture

BOBST MEX SA

Lateral positioning device for a sheet element

VANGUARD INT SEMICONDUCT CORP

Semiconductor structure and method of fabricating the same