Inventor
YOKOYAMA TAKASHI
JP185 patents
⚠️ This page may combine multiple inventors who share the name “YOKOYAMA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
18 patentsUS6263204B1Jul 17, 2001
Switching center for mobile handover
HITACHI LTD97 citations99
US5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6754495B2Jun 22, 2004
Handover method in mobile communication system
HITACHI LTD39 citations96
US6108546AAug 22, 2000
Handover method in mobile communication system
HITACHI LTD33 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US4970577ANov 13, 1990
Semiconductor chip module
HITACHI LTD71 citations96
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US7733859B2Jun 8, 2010
Apparatus and method for packet forwarding in layer 2 network
HITACHI LTD25 citations92
US6259920B1Jul 10, 2001
Handover method in mobile communication system
HITACHI LTD22 citations92
US5530304AJun 25, 1996
Miniature motor and fan using the same
HITACHI LTD42 citations92
US5231914AAug 3, 1993
Variable displacement compressor
HITACHI LTD27 citations92
US5105728AApr 21, 1992
Balanced variable-displacement compressor
HITACHI LTD40 citations92
NEC CORP
7 patentsUS6245665B1Jun 12, 2001
Semiconductor device and method of fabricating the same
NEC CORP493 citations99
US6255732B1Jul 3, 2001
Semiconductor device and process for producing the same
NEC CORP46 citations96
US6344411B1Feb 5, 2002
OHMIC contact plug having an improved crack free tin barrier metal in a contact hole and method of forming the same
NEC CORP27 citations93
US6225196B1May 1, 2001
High electron mobility transistor and method of fabricating the same
NEC CORP21 citations93
US6049091AApr 11, 2000
High electron mobility transistor
NEC CORP25 citations93
US6294467B1Sep 25, 2001
Process for forming fine wiring
NEC CORP47 citations92
US6130154AOct 10, 2000
Semiconductor device and fabrication process thereof
NEC CORP34 citations92
SONY CORP
6 patentsUS9577005B2Feb 21, 2017
Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode
SONY CORP11 citations93
US9412788B2Aug 9, 2016
Semiconductor device structure useful for bulk transistor and method of manufacturing the same
SONY CORP16 citations93
US9171887B2Oct 27, 2015
Semiconductor device and method of manufacturing same
SONY CORP18 citations93
US9093575B2Jul 28, 2015
Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode
SONY CORP16 citations93
US10615334B2Apr 7, 2020
Memory cell structure, method of manufacturing a memory, and memory apparatus
SONY CORP5 citations84
US10615214B2Apr 7, 2020
Semiconductor device, solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode
SONY CORP5 citations84
AISIN SEIKI
3 patentsMASUOKA FUJIO
2 patentsSHARP KK
2 patentsMCC CORP
2 patentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD
2 patentsKANZAKI KOKYUKOKI MFG CO LTD
1 patentNEC ELECTRONICS CORP
1 patentFUJIO MASUOKA
1 patentDAIDO HOXAN INC
1 patentHITACHI COMM TECH LTD
1 patentHOXAN KK
1 patentSONY SEMICONDUCTOR SOLUTIONS CORP
1 patentNICHICON CORP
1 patentShowing the top 50 of 185 patents by PatentIndex Score.